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w25q16cv publication release date: april 01, 2011 - 1 - revision c 3v 16m-bit serial flash memory with dual and quad spi
w25q16cv - 2 - table of contents 1. general description ............................................................................................................... 5 2. features .............................................................................................................................. ......... 5 3. package types and pin configurations ........................................................................... 6 3.1 pin configuration soic 150 / 208-mil .................................................................................. 6 3.2 pad configuration wson 6x5-mm ...................................................................................... 6 3.3 pin configuration pdip 300-mil ............................................................................................ 7 3.4 pin description soic 150/208-mil, wson 6x5-mm and pdip 300-mil ............................... 7 3.5 pin configuration soic 300-mil ........................................................................................... 8 3.6 pin description soic 300-mil ............................................................................................... 8 3.7 ball configuration tfbga 8x6-mm ...................................................................................... 9 3.8 ball description tfbga 8x6-mm ......................................................................................... 9 4. pin descriptions ...................................................................................................................... 10 4.1 chip select (/cs) ................................................................................................................ 10 4.2 serial data input, output and ios (di, do and io0, io1, io2, io3) ................................... 10 4.3 write protect (/wp) ............................................................................................................ 10 4.4 hold (/hold) ................................................................................................................... 10 4.5 serial clock (clk) .............................................................................................................. 10 5. block diagram .......................................................................................................................... 11 6. functional description ....................................................................................................... 12 6.1 spi operations ............................................................................................................. 12 6.1.1 standard spi instructions ..................................................................................................... 12 6.1.2 dual spi instructions ............................................................................................................ 12 6.1.3 quad spi instructions .......................................................................................................... 12 6.1.4 hold function ....................................................................................................................... 12 6.2 write protection ....................................................................................................... 13 6.2.1 write protect features ......................................................................................................... 13 7. status registers and instructions ............................................................................... 14 7.1 status registers ........................................................................................................ 14 7.1.1 busy status (busy) ........................................................................................................... 14 7.1.2 write enable latch status (wel) ........................................................................................ 14 7.1.3 block protect bits (bp2, bp1, bp0) ..................................................................................... 14 7.1.4 top/bottom block protect bit (tb) ....................................................................................... 14 7.1.5 sector/block protect bit (sec) ............................................................................................. 14 7.1.6 complement protect bit (cmp) ............................................................................................ 14 7.1.7 status register protect bits (srp1, srp0) ......................................................................... 15 7.1.8 erase/program suspend status (sus) ................................................................................ 15 7.1.9 security register lock bits (lb3, lb2, lb1) ........................................................................ 15
w25q16cv 7.1.10 quad enable bit (qe) ......................................................................................................... 15 publication release date: april 01, 2011 - 3 - revision c 7.1.11 status register memory protection (cmp = 0) .................................................................. 17 7.1.12 status register memory protection (cmp = 1) .................................................................. 18 7.2 instructions ................................................................................................................. 19 7.2.1 manufacturer and device identification ................................................................................ 19 7.2.2 instruction set table 1 (erase, program instructions) ......................................................... 20 7.2.3 instruction set table 2 (read instructions) .......................................................................... 21 7.2.4 instruction set table 3 (id, security instructions) ................................................................ 22 7.2.5 write enable (06h) ............................................................................................................... 23 7.2.6 write enable for volatile status register (50h) .................................................................... 23 7.2.7 write disable (04h) .............................................................................................................. 24 7.2.8 read status register-1 (05h) and read status register-2 (35h) ........................................ 25 7.2.9 write status register (01h) .................................................................................................. 25 7.2.10 read data (03h) ................................................................................................................. 27 7.2.11 fast read (0bh) ................................................................................................................. 28 7.2.12 fast read dual output (3bh) ............................................................................................. 29 7.2.13 fast read quad output (6bh) ........................................................................................... 30 7.2.14 fast read dual i/o (bbh) .................................................................................................. 31 7.2.15 fast read quad i/o (ebh) ................................................................................................. 33 7.2.16 word read quad i/o (e7h) ................................................................................................ 35 7.2.17 octal word read quad i/o (e3h) ...................................................................................... 37 7.2.18 set burst with wrap (77h) .................................................................................................. 39 7.2.19 continuous read mode bits (m7-0) ................................................................................... 40 7.2.20 continuous read mode reset (ffh or ffffh) .................................................................. 40 7.2.21 page program (02h) ........................................................................................................... 41 7.2.22 quad input page program (32h) ........................................................................................ 42 7.2.23 sector erase (20h) ............................................................................................................. 43 7.2.24 32kb block erase (52h) ..................................................................................................... 44 7.2.25 64kb block erase (d8h) .................................................................................................... 45 7.2.26 chip erase (c7h / 60h) ....................................................................................................... 46 7.2.27 erase / program suspend (75h) ......................................................................................... 47 7.2.28 erase / program resume (7ah) ......................................................................................... 48 7.2.29 power-down (b9h) .............................................................................................................. 49 7.2.30 release power-down / device id (abh) ............................................................................. 50 7.2.31 read manufacturer / device id (90h) ................................................................................. 52 7.2.32 read manufacturer / device id dual i/o (92h) ................................................................... 53 7.2.33 read manufacturer / device id quad i/o (94h) ................................................................. 54 7.2.34 read unique id number (4bh) .......................................................................................... 55 7.2.35 read jedec id (9fh) ........................................................................................................ 56 7.2.36 read sfdp register (5ah) ................................................................................................ 57 7.2.37 erase security registers (44h) .......................................................................................... 60
w25q16cv 7.2.38 program security registers (42h) ...................................................................................... 61 - 4 - 7.2.39 read security registers (48h) ........................................................................................... 62 8. electrical characteristics ............................................................................................... 63 8.1 absolute maximum ratings ................................................................................................ 63 8.2 operating ranges ............................................................................................................... 63 8.3 power-up timing and write inhibit threshold .................................................................... 64 8.4 dc electrical characteristics .............................................................................................. 65 8.5 ac measurement conditions .............................................................................................. 66 8.6 ac electrical characteristics .............................................................................................. 67 8.7 ac electrical characteristics (cont?d) ................................................................................. 68 8.8 serial output timing ........................................................................................................... 69 8.9 serial input timing .............................................................................................................. 69 8.10 /hold timing ..................................................................................................................... 69 8.11 /wp timing ......................................................................................................................... 69 9. package specification .......................................................................................................... 70 9.1 8-pin soic 150-mil (package code sn) ............................................................................ 70 9.2 8-pin soic 208-mil (package code ss) ............................................................................ 71 9.3 8-pin pdip 300-mil (package code da) ............................................................................ 72 9.4 8-pad wson 6x5mm (package code zp) ........................................................................ 73 9.5 16-pin soic 300-mil (package code sf) .......................................................................... 75 9.6 24-ball tfbga 8x6-mm (package code tc) .................................................................... 76 10. ordering information .......................................................................................................... 77 10.1 valid part numbers and top side marking ........................................................................ 78 11. revision history ...................................................................................................................... 79
w25q16cv publication release date: april 01, 2011 - 5 - revision c 1. general description the w25q16cv (16m-bit) serial flash memory provides a storage solution for systems with limited space, pins and power. the 25q series offers flexibility and performance well beyond ordinary serial flash devices. they are ideal for code shadowing to ram, executing code directly from dual/quad spi (xip) and storing voice, text and data. the device operates on a single 2.7v to 3.6v power supply with current consumption as low as 4ma active and 1a for power-down. the w25q16cv array is organized into 8,192 programmable pages of 256-bytes each. up to 256 bytes can be programmed at a time. pages can be erased in groups of 16 (4kb sector erase), groups of 128 (32kb block erase), groups of 256 (64kb block erase) or the entire chip (chip erase). the w25q16cv has 512 erasable sectors and 32 erasable blocks respectively. the small 4kb sectors allow for greater flexibility in applications that require data and parameter storage. (see figure 2.) the w25q16cv supports the standard serial peripheral interface (spi), and a high performance dual/quad output as well as dual/quad i/o spi: serial clock, chip select, serial data i/o0 (di), i/o1 (do), i/o2 (/wp), and i/o3 (/hold). spi clock frequencies of up to 104mhz are supported allowing equivalent clock rates of 208mhz (104mhz x 2) for dual i/o and 416mhz (104mhz x 4) for quad i/o when using the fast read dual/quad i/o instructions. these transfer rates can outperform standard asynchronous 8 and 16-bit parallel flash memories. the continuous read mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true xip (execute in place) operation. a hold pin, write protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. additionally, the device supports jedec standard manufacturer and device identification with a 64-bit unique serial number. 2. features ? family of spiflash memories ? w25q16cv: 16m-bit / 2m-byte (2,097,152) ? 256-byte per programmable page ? standard spi: clk, /cs, di, do, /wp, /hold ? dual spi: clk, /cs, io 0 , io 1 , /wp, /hold ? quad spi: clk, /cs, io 0 , io 1 , io 2 , io 3 ? highest performance serial flash ? 104mhz dual spi / quad spi clocks ? 208/416mhz equivalent dual/quad spi ? 52mb/s continuous data transfer rate ? up to 8x that of ordinary serial flash ? more than 100,000 erase/program cycles (1) ? more than 20-year data retention ? efficient ?continuous read mode? ? low instruction overhead ? continuous read with 8/16/32/64-byte wrap ? as few as 8 clocks to address memory ? allows true xip (execute in place) operation ? outperforms x16 parallel flash ? low power, wide temperature range ? single 2.7 to 3.6v supply ? 4ma active current, <1a power-down (typ.) ? -40c to +85c operating range ? flexible architecture with 4kb sectors ? uniform sector/block erase (4/32/64k-bytes) ? program one to 256 bytes ? erase/program suspend & resume ? advanced security & identification features ? software and hardware write-protect ? top/bottom, 4kb complement array protection ? power supply lock-down and otp protection ? 64-bit unique id for each device ? discoverable parameters (sfdp) register ? 3x256-byte security registers with otp locks ? volatile & non-volatile status register bits ? space efficient packaging ? 8-pin soic 150 (2) /208-mil ? 8-pad wson 6x5-mm ? 8-pin pdip 300-mil (2) ? 16-pin soic 300-mil (2) ? 24-ball tfbga 8x6-mm ? contact winbond for kgd and other options note 1. more than 100,000 block erase/program cycles for industrial and automotive temperature; more than 10,000 full chip erase/program cycles tested in compliance with aec-q100. 2. these are special order packages, please contact winbond for ordering information.
w25q16cv - 6 - 3. package types and pin configurations w25q16cv is offered in an 8-pin soic 150-mil or 208-mil (package code sn & ss), an 8-pad wson 6x5-mm (package code zp), an 8-pin pdip 300-mil (package code da), a 16-pin soic 300-mil (package code sf) and a 24-ball 8x6-mm tfbga (package code tc) as shown in figure 1a-e respectively. package diagrams and dimensions are illustrated at the end of this datasheet. 3.1 pin configuration soic 150 / 208-mil 1 2 3 4 8 7 6 5 /cs do (io 1 ) /wp (io 2 ) gnd vcc /hold (io di (io 0 ) clk top view 3 ) figure 1a. w25q16cv pin assignments, 8-pin soic 150 / 208-mil (package code sn & ss) 3.2 pad configuration wson 6x5-mm 1 2 3 4 /cs do (io 1 ) /wp (io 2 ) gnd vcc /hol di (io clk d (io 3 ) 0 ) top view 8 7 6 5 figure 1b. w25q16cv pad assignments, 8-pad wson 6x5-mm (package code zp)
w25q16cv publication release date: april 01, 2011 - 7 - revision c 3.3 pin configuration pdip 300-mil 1 2 3 4 8 7 6 5 /cs do (io 1 ) /wp (io 2 ) gnd vcc /hold (io 3 ) di (io 0 ) clk top view figure 1c. w25q16cv pin assignments, 8-pin pdip (package code da) 3.4 pin description soic 150/208-mil, wson 6x5-mm and pdip 300-mil pin no. pin name i/o function 1 /cs i chip select input 2 do (io1) i/o data output (data input output 1)* 1 3 /wp (io2) i/o write protect input ( data input output 2)* 2 4 gnd ground 5 di (io0) i/o data input (data input output 0)* 1 6 clk i serial clock input 7 /hold (io3) i/o hold input (data input output 3)* 2 8 vcc power supply *1 io0 and io1 are used for standard and dual spi instructions *2 io0 ? io3 are used for quad spi instructions
w25q16cv - 8 - 3.5 pin configuration soic 300-mil 1 2 3 4 /cs do (io 1 )/ w p ( i o 2 ) gnd vcc /hold (io 3 ) di (io 0 ) clk top view nc nc nc nc nc nc nc nc 5 6 7 8 10 9 11 12 13 14 15 16 figure 1d. w25q16cv pin assignments, 16-pin soic 300-mil (package code sf) 3.6 pin description soic 300-mil pin no. pin name i/o function 1 /hold (io3) i/o hold input (data input output 3)* 2 2 vcc power supply 3 n/c no connect 4 n/c no connect 5 n/c no connect 6 n/c no connect 7 /cs i chip select input 8 do (io1) i/o data output (data input output 1)* 1 9 /wp (io2) i/o write protect input (data input output 2)* 2 10 gnd ground 11 n/c no connect 12 n/c no connect 13 n/c no connect 14 n/c no connect 15 di (io0) i/o data input (data input output 0)* 1 16 clk i serial clock input *1 io0 and io1 are used for standard and dual spi instructions *2 io0 ? io3 are used for quad spi instructions
w25q16cv publication release date: april 01, 2011 - 9 - revision c 3.7 ball configuration tfbga 8x6-mm top view a1 nc nc nc a2 a3 a4 nc b1 vcc gnd clk b2 b3 b4 nc d1 /hold(io 3 ) di(io 0 ) do(io 1 ) /wp (io 2 ) d2 d3 d4 nc e1 nc nc nc e2 e3 e4 nc f1 nc nc nc f2 f3 f4 nc c1 nc /cs c2 c3 c4 nc figure 1e. w25q16cv ball assignments, 24-ball tfbga 8x6-mm (package code tc) 3.8 ball description tfbga 8x6-mm ball no. pin name i/o function b2 clk i serial clock input b3 gnd ground b4 vcc power supply c2 /cs i chip select input c4 /wp (io2) i/o write protect input (data input output 2)* 2 d2 do (io1) i/o data output (data input output 1)* 1 d3 di (io0) i/o data input (data input output 0)* 1 d4 /hold (io3) i/o hold input (data input output 3)* 2 multiple nc no connect *1 io0 and io1 are used for standard and dual spi instructions *2 io0 ? io3 are used for quad spi instructions
w25q16cv - 10 - 4. pin descriptions 4.1 chip select (/cs) the spi chip select (/cs) pin enables and disables device operation. when /cs is high the device is deselected and the serial data output (do, or io0, io1, io2, io3) pins are at high impedance. when deselected, the devices power consumption will be at standby levels unless an internal erase, program or write status register cycle is in progress. when /cs is brought low the device will be selected, power consumption will increase to active levels and instructions can be written to and data read from the device. after power-up, /cs must transition from high to low before a new instruction will be accepted. the /cs input must track the vcc supply level at power-up (see ?write protection? and figure 38). if needed a pull- up resister on /cs can be used to accomplish this. 4.2 serial data input, output and ios (di, do and io0, io1, io2, io3) the w25q16cv supports standard spi, dual spi and quad spi operation. standard spi instructions use the unidirectional di (input) pin to serially write in structions, addresses or data to the device on the rising edge of the serial clock (clk) input pin. standard spi also uses the unidirectional do (output) to read data or status from the device on the falling edge of clk. dual and quad spi instructions use the bidirectional io pins to serially write instructions, addresses or data to the device on the rising edge of clk and read data or status from the device on the falling edge of clk. quad spi instructions require the non-volatile quad enable bit (qe) in status register-2 to be set. when qe=1, the /wp pin becomes io2 and /hold pin becomes io3. 4.3 write protect (/wp) the write protect (/wp) pin can be used to prevent the status register from being written. used in conjunction with the status register?s block protect (cmp, sec, tb, bp2, bp1 and bp0) bits and status register protect (srp) bits, a portion as small as a 4kb sector or the entire memory array can be hardware protected. the /wp pin is active low. when the qe bit of status register-2 is set for quad i/o, the /wp pin function is not available since this pin is used for io2. see figure 1a-e for the pin configuration of quad i/o operation. 4.4 hold (/hold) the /hold pin allows the device to be paused while it is actively selected. when /hold is brought low, while /cs is low, the do pin will be at high impedance and signals on the di and clk pins will be ignored (don?t care). when /hold is brought high, device operation can resume. the /hold function can be useful when multiple devices are sharing the same spi signals. the /hold pin is active low. when the qe bit of status register-2 is set for quad i/o, the /hold pin function is not available since this pin is used for io3. see figure 1a-e for the pin configuration of quad i/o operation. 4.5 serial clock (clk) the spi serial clock input (clk) pin provides the timing for serial input and output operations. ("see spi operations")
w25q16cv publication release date: april 01, 2011 - 11 - revision c 5. block diagram figure 2. w25q16cv serial flash memory block diagram 003000h 0030ffh 002000h 0020ffh 001000h 0010ffh column decode and 256-byte page buffer beginning page address ending page address w25q16cv spi command & control logic byte address latch / counter status register write control logic page address latch / counter do (io 1 ) di (io 0 ) /cs clk /hold (io 3 ) /wp (io 2 ) high voltage generators xx0f00h xx0fffh ? sector 0 (4kb) ? xx0000h xx00ffh xx1f00h xx1fffh ? sector 1 (4kb) ? xx1000h xx10ffh xx2f00h xx2fffh ? sector 2 (4kb) ? xx2000h xx20ffh ? ? ? xxdf00h xxdfffh ? sector 13 (4kb) ? xxd000h xxd0ffh xxef00h xxefffh ? sector 14 (4kb) ? xxe000h xxe0ffh xxff00h xxffffh ? sector 15 (4kb) ? xxf000h xxf0ffh block segmentation data security register 1 - 3 write protect logic and row decode 00ff00h 00ffffh ? block 0 (64kb) ? 000000h 0000ffh ? ? ? 07ff00h 07ffffh ? block 7 (64kb) ? 070000h 0700ffh 08ff00h 08ffffh ? block 8 (64kb) ? 080000h 0800ffh ? ? ? 0fff00h 0fffffh ? block 15 (64kb) ? 0f0000h 0f00ffh 10ff00h 10ffffh ? block 16 (64kb) ? 100000h 1000ffh ? ? ? 1fff00h 1fffffh ? block 31 (64kb) ? 1f0000h 1f00ffh 000000h 0000ffh sfdp register 003000h 0030ffh 002000h 0020ffh 001000h 0010ffh column decode and 256-byte page buffer beginning page address ending page address w25q16cv spi command & control logic byte address latch / counter status register write control logic page address latch / counter do (io 1 ) di (io 0 ) /cs clk /hold (io 3 ) /wp (io 2 ) high voltage generators xx0f00h xx0fffh ? sector 0 (4kb) ? xx0000h xx00ffh xx1f00h xx1fffh ? sector 1 (4kb) ? xx1000h xx10ffh xx2f00h xx2fffh ? sector 2 (4kb) ? xx2000h xx20ffh ? ? ? xxdf00h xxdfffh ? sector 13 (4kb) ? xxd000h xxd0ffh xxef00h xxefffh ? sector 14 (4kb) ? xxe000h xxe0ffh xxff00h xxffffh ? sector 15 (4kb) ? xxf000h xxf0ffh block segmentation data security register 1 - 3 write protect logic and row decode 00ff00h 00ffffh ? block 0 (64kb) ? 000000h 0000ffh ? ? ? 07ff00h 07ffffh ? block 7 (64kb) ? 070000h 0700ffh 08ff00h 08ffffh ? block 8 (64kb) ? 080000h 0800ffh ? ? ? 0fff00h 0fffffh ? block 15 (64kb) ? 0f0000h 0f00ffh 10ff00h 10ffffh ? block 16 (64kb) ? 100000h 1000ffh ? ? ? 1fff00h 1fffffh ? block 31 (64kb) ? 1f0000h 1f00ffh 000000h 0000ffh sfdp register
w25q16cv - 12 - 6. functional description 6.1 spi operations 6.1.1 standard spi instructions the w25q16cv is accessed through an spi compatible bus consisting of four signals: serial clock (clk), chip select (/cs), serial data input (di) and serial data output (do). standard spi instructions use the di input pin to serially write instructions, addresses or data to the device on the rising edge of clk. the do output pin is used to read data or status from the device on the falling edge clk. spi bus operation mode 0 (0,0) and 3 (1,1) are supported. the primary difference between mode 0 and mode 3 concerns the normal state of the clk signal when the spi bus master is in standby and data is not being transferred to the serial flash. for mode 0, the clk signal is normally low on the falling and rising edges of /cs. for mode 3, the clk signal is normally high on the falling and rising edges of /cs. 6.1.2 dual spi instructions the w25q16cv supports dual spi operation when using the ?fast read dual output (3bh)? and ?fast read dual i/o (bbh)? instructions. these instructions allow data to be transferred to or from the device at two to three times the rate of ordinary serial flash devices. the dual spi read instructions are ideal for quickly downloading code to ram upon power-up (code-shadowing) or for executing non-speed-critical code directly from the spi bus (xip). when using dual spi instructions, the di and do pins become bidirectional i/o pins: io0 and io1. 6.1.3 quad spi instructions the w25q16cv supports quad spi operation when using the ?fast read quad output (6bh)?, ?fast read quad i/o (ebh)?, ?word read quad i/o (e7h)? and ?octal word read quad i/o (e3h)? instructions. these instructions allow data to be transferred to or from the device four to six times the rate of ordinary serial flash. the quad read instructions offer a significant improvement in continuous and random access transfer rates allowing fast code-shadowing to ram or execution directly from the spi bus (xip). when using quad spi instructions the di and do pi ns become bidirectional io0 and io1, and the /wp and /hold pins become io2 and io3 respectively. quad spi instructions require the non-volatile quad enable bit (qe) in status register-2 to be set. 6.1.4 hold function for standard spi and dual spi operations, the /hold signal allows the w25q16cv operation to be paused while it is actively selected (when /cs is low). the /hold function may be useful in cases where the spi data and clock signals are shared with other devices. for example, consider if the page buffer was only partially written when a priority interrupt requires use of the spi bus. in this case the /hold function can save the state of the instruction and the data in the buffer so programming can resume where it left off once the bus is available again. the /h old function is only available for standard spi and dual spi operation, not during quad spi. to initiate a /hold condition, the device must be selected with /cs low. a /hold condition will activate on the falling edge of the /hold signal if the clk signal is already low. if the clk is not already low the /hold condition will activate after the next falling edge of clk. the /hold condition will terminate on the rising edge of the /hold signal if the clk signal is already low. if the clk is not already low the /hold condition will terminate after the next falling edge of clk. during a /hold condition, the serial data
w25q16cv publication release date: april 01, 2011 - 13 - revision c output (do) is high impedance, and serial data input (di) and serial clock (clk) are ignored. the chip select (/cs) signal should be kept active (low) for the full duration of the /hold operation to avoid resetting the internal logic state of the device. 6.2 write protection applications that use non-volatile memory must take into consideration the possibility of noise and other adverse system conditions that may compromise data integrity. to address this concern, the w25q16cv provides several means to protect the data from inadvertent writes. 6.2.1 write protect features ? device resets when vcc is below threshold ? time delay write disable after power-up ? write enable/disable instructions and automatic write disable after erase or program ? software and hardware (/wp pin) write protection using status register ? write protection using power-down instruction ? lock down write protection until next power-up ? one time program (otp) write protection * * note: this feature is available upon special order. please contact winbond for details. upon power-up or at power-down, the w25q16cv will maintain a reset condition while vcc is below the threshold value of v wi , (see power-up timing and voltage levels and figure 38). while reset, all operations are disabled and no instructions are recognized. during power-up and after the vcc voltage exceeds v wi , all program and erase related instructions are further disabled for a time delay of t puw . this includes the write enable, page program, sector erase, block erase, chip erase and the write status register instructions. note that the chip select pin (/cs) must track the vcc supply level at power-up until the vcc-min level and t vsl time delay is reached. if needed a pull-up resister on /cs can be used to accomplish this. after power-up the device is automatically placed in a write-disabled state with the status register write enable latch (wel) set to a 0. a write enable instruction must be issued before a page program, sector erase, block erase, chip erase or write status register instruction will be accepted. after completing a program, erase or write instruction the write enable latch (wel) is automatically cleared to a write- disabled state of 0. software controlled write protection is facilitated usi ng the write status register instruction and setting the status register protect (srp0, srp1) and block protect (cmp, sec,tb, bp2, bp1 and bp0) bits. these settings allow a portion as small as 4kb sector or the entire memory array to be configured as read only. used in conjunction with the write protect (/wp) pin, changes to the status register can be enabled or disabled under hardware control. see status register section for further information. additionally, the power-down instruction offers an extra level of write protection as all instructions are ignored except for the release power-down instruction.
w25q16cv - 14 - 7. status registers and instructions the read status register-1 and status register-2 instructions can be used to provide status on the availability of the flash memory array, if the device is write enabled or disabled, the state of write protection, quad spi setting, security register lock status and erase/program suspend status. the write status register instruction can be used to configure the device write protection features, quad spi setting and security register otp lock. write access to the status register is controlled by the state of the non- volatile status register protect bits (srp0, srp1), the write enable instruction, and during standard/dual spi operations, the /wp pin. 7.1 status registers 7.1.1 busy status (busy) busy is a read only bit in the status register (s0) that is set to a 1 state when the device is executing a page program, quad page program, sector erase, block erase, chip erase, write status register or erase/program security register instruction. during this time the device will ignore further instructions except for the read status register and erase/program suspend instruction (see t w , t pp , t se , t be , and t ce in ac characteristics). when the program, erase or write status/security register instruction has completed, the busy bit will be cleared to a 0 state indicating the device is ready for further instructions. 7.1.2 write enable latch status (wel) write enable latch (wel) is a read only bit in the status register (s1) that is set to 1 after executing a write enable instruction. the wel status bit is cleared to 0 when the device is write disabled. a write disable state occurs upon power-up or after any of the following instructions: write disable, page program, quad page program, sector erase, block erase, chip erase, write status register, erase security register and program security register. 7.1.3 block protect bits (bp2, bp1, bp0) the block protect bits (bp2, bp1, bp0) are non-volatile read/write bits in the status register (s4, s3, and s2) that provide write protection control and status. block protect bits can be set using the write status register instruction (see t w in ac characteristics). all, none or a portion of the memory array can be protected from program and erase instructions (see status register memory protection table). the factory default setting for the block protection bits is 0, none of the array protected. 7.1.4 top/bottom block protect bit (tb) the non-volatile top/bottom bit (tb) controls if the block protect bits (bp2, bp1, bp0) protect from the top (tb=0) or the bottom (tb=1) of the array as shown in the status register memory protection table. the factory default setting is tb=0. the tb bit can be set with the write status register instruction depending on the state of the srp0, srp1 and wel bits. 7.1.5 sector/block prot ect bit (sec) the non-volatile sector/block protect bit (sec) controls if the block protect bits (bp2, bp1, bp0) protect either 4kb sectors (sec=1) or 64kb blocks (sec=0) in the top (tb=0) or the bottom (tb=1) of the array as shown in the status register memory protection table. the default setting is sec=0. 7.1.6 complement protect bit (cmp) the complement protect bit (cmp) is a non-volatile read/write bit in the status register (s14). it is used in conjunction with sec, tb, bp2, bp1 and bp0 bits to provide more flexibility for the array protection. once
w25q16cv publication release date: april 01, 2011 - 15 - revision c cmp is set to 1, previous array protection set by sec, tb, bp2, bp1 and bp0 will be reversed. for instance, when cmp=0, a top 4kb sector can be protected while the rest of the array is not; when cmp=1, the top 4kb sector will become unprotected while the rest of the array become read-only. please refer to the status register memory protection table for details. the default setting is cmp=0. 7.1.7 status register protect bits (srp1, srp0) the status register protect bits (srp1 and srp0) are non-volatile read/write bits in the status register (s8 and s7). the srp bits control the method of write protection: software protection, hardware protection, power supply lock-down or one time programmable (otp) protection. srp1 srp0 /wp status register description 0 0 x software protection /wp pin has no control. the status register can be written to after a write enable instruction, wel=1. [factory default] 0 1 0 hardware protected when /wp pin is low the status register locked and can not be written to. 0 1 1 hardware unprotected when /wp pin is high the status register is unlocked and can be written to after a write enable instruction, wel=1. 1 0 x power supply lock-down status register is protected and can not be written to again until the next power-down, power-up cycle. (1) 1 1 x one time program (2) status register is permanently protected and can not be written to. notes: 1. when srp1, srp0 = (1, 0), a power-down, power-up cycle will change srp1, srp0 to (0, 0) state. 2. this feature is available upon special order. please contact winbond for details. 7.1.8 erase/program suspe nd status (sus) the suspend status bit is a read only bit in the status register (s15) that is set to 1 after executing a erase/program suspend (75h) instruction. the sus status bit is cleared to 0 by erase/program resume (7ah) instruction as well as a power-down, power-up cycle. 7.1.9 security register lock bits (lb3, lb2, lb1) the security register lock bits (lb3, lb2, lb1) are non-volatile one time program (otp) bits in status register (s13, s12, s11) that provide the write protect control and status to the security registers. the default state of lb[3:1] is 0, security registers are unlocked. lb[3:1] can be set to 1 individually using the write status register instruction. lb[3:1] are one time programmable (otp), once it?s set to 1, the corresponding 256-byte security register will become read-only permanently. 7.1.10 quad enable bit (qe) the quad enable (qe) bit is a non-volatile read/write bit in the status register (s9) that allows quad spi operation. when the qe bit is set to a 0 state (factory default), the /wp pin and /hold are enabled. when
w25q16cv - 16 - the qe bit is set to a 1, the quad io2 and io3 pins are enabled, and /wp and /hold functions are disabled. warning: if the /wp or /hold pins are tied directly to the power supply or ground during standard spi or dual spi operation, the qe bit should never be set to a 1. s7 s6 s5 s4 s3 s2 s1 s0 srp0 sec tb bp2 bp1 bp0 wel busy status register protect 0 (non-volatile) sector protect (non-volatile) top/bottom protect (non-volatile) block protect bits (non-volatile) write enable latch erase/write in progress s7 s6 s5 s4 s3 s2 s1 s0 srp0 sec tb bp2 bp1 bp0 wel busy status register protect 0 (non-volatile) sector protect (non-volatile) top/bottom protect (non-volatile) block protect bits (non-volatile) write enable latch erase/write in progress figure 3a. status register-1 s15 s14 s13 s12 s11 s10 s9 s8 sus cmp lb3 lb2 lb1 (r) qe srp1 suspend status complement protect (non-volatile) security register lock bits (non-volatile otp) quad enable (non-volatile) status register protect 1 ( non-volatile ) reserved s15 s14 s13 s12 s11 s10 s9 s8 sus cmp lb3 lb2 lb1 (r) qe srp1 suspend status complement protect (non-volatile) security register lock bits (non-volatile otp) quad enable (non-volatile) status register protect 1 ( non-volatile ) reserved figure 3b. status register-2
w25q16cv publication release date: april 01, 2011 - 17 - revision c 7 .1.11 s tatus register memory protection (cmp = 0) status register (1) w25q16cv (16m-bit) memory protection (3) sec tb bp2 bp1 bp0 protected block(s) protected addresses protected density protected portion (2) x x 0 0 0 none no ne none none 0 0 0 0 1 31 1f0000h ? 1 fffffh 64kb upper 1/32 0 0 0 1 0 30 and 31 1e0000h ? 1fffffh 128kb upper 1/16 0 0 0 1 1 28 thru 31 1c0000h ? 1fffffh 256kb upper 1/8 0 0 1 0 0 24 thru 31 180000h ? 1fffffh 512kb upper 1/4 0 0 1 0 1 16 thru 31 100000h ? 1fffffh 1mb upper 1/2 0 1 0 0 1 0 000000h ? 00 ffffh 64kb lower 1/32 0 1 0 1 0 0 and 1 000000h ? 01ffffh 128kb lower 1/16 0 1 0 1 1 0 thru 3 000000h ? 03ffffh 256kb lower 1/8 0 1 1 0 0 0 thru 7 000000h ? 07ffffh 512kb lower 1/4 0 1 1 0 1 0 thru 15 000000h ? 0fffffh 1mb lower 1/2 x x 1 1 x 0 thru 31 000000h ? 1 fffffh 2mb all 1 0 0 0 1 31 1ff000h ? 1fffffh 4kb u ? 1/512 1 0 0 1 0 31 1fe000h ? 1fffffh 8kb u ? 1/256 1 0 0 1 1 31 1fc000h ? 1fffffh 16kb u ? 1/128 1 0 1 0 x 31 1f8000h ? 1fffffh 32kb u ? 1/64 1 1 0 0 1 0 000000h ? 000 fffh 4kb l ? 1/512 1 1 0 1 0 0 000000h ? 001 fffh 8kb l ? 1/256 1 1 0 1 1 0 000000h ? 003 fffh 16kb l ? 1/128 1 1 1 0 x 0 000000h ? 007fffh 32kb l ? 1/64 notes: 1. x = don?t care 2. l = lower; u = upper 3. if any erase or program command specifies a memory region that contains protected data portion, this command will be ignored.
w25q16cv - 18 - 7 .1.12 s tatus register memory protection (cmp = 1) status register (1) w25q16cv (16m-bit) memory protection (3) sec tb bp2 bp1 bp0 protected block(s) protected addresses protected density protected portion (2) x x 0 0 0 0 thru 31 000000h ? 1 fffffh all all 0 0 0 0 1 0 thru 30 000000h ? 1effffh 1,984kb lower 31/32 0 0 0 1 0 0 thru 29 000000h ? 1dffffh 1,920kb lower 15/16 0 0 0 1 1 0 thru 27 000000h ? 1bffffh 1,792kb lower 7/8 0 0 1 0 0 0 thru 23 000000h ? 17ffffh 1,536kb lower 3/4 0 0 1 0 1 0 thru 15 000000h ? 0fffffh 1mb lower 1/2 0 1 0 0 1 1 thru 31 010000h ? 1fffffh 1,984kb upper 31/32 0 1 0 1 0 2 and 31 020000h ? 1 fffffh 1,920kb upper 15/16 0 1 0 1 1 4 thru 31 040000h ? 1fffffh 1,792kb upper 7/8 0 1 1 0 0 8 thru 31 080000h ? 1fffffh 1,536kb upper 3/4 0 1 1 0 1 16 thru 31 100000h ? 1fffffh 1mb upper 1/2 x x 1 1 x none no ne none none 1 0 0 0 1 0 thru 31 000000h ? 1fefffh 2,044kb l ? 511/512 1 0 0 1 0 0 thru 31 000000h ? 1fdfffh 2,040kb l ? 255/256 1 0 0 1 1 0 thru 31 000000h ? 1fbfffh 2,032kb l ? 127/128 1 0 1 0 x 0 thru 31 000000h ? 1f7fffh 2,016kb l ? 63/64 1 1 0 0 1 0 thru 31 001000h ? 1fffffh 2,044kb u ? 511/512 1 1 0 1 0 0 thru 31 002000h ? 1fffffh 2,040kb u ? 255/256 1 1 0 1 1 0 thru 31 004000h ? 1fffffh 2,032kb u ? 127/128 1 1 1 0 x 0 thru 31 008000h ? 1fffffh 2,016kb u ? 63/64 notes: 1. x = don?t care 2. l = lower; u = upper 3. if any erase or program command specifies a memory region that contains protected data portion, this command will be ignored.
w25q16cv publication release date: april 01, 2011 - 19 - revision c 7.2 instructions the instruction set of the w25q16cv consists of thirty five basic instructions that are fully controlled through the spi bus (see instruction set table1-3). instructions are initiated with the falling edge of chip select (/cs). the first byte of data clocked into the di input provides the instruction code. data on the di input is sampled on the rising edge of clock with most significant bit (msb) first. instructions vary in length from a single byte to several bytes and may be followed by address bytes, data bytes, dummy bytes (don?t care), and in some cases, a combination. instructions are completed with the rising edge of edge /cs. clock relative timing diagrams for each instruction are included in figures 4 through 37. all read instructions can be completed after any clocked bit. however, all instructions that write, program or erase must complete on a byte boundary (/cs driven high after a full 8-bits have been clocked) otherwise the instruction will be ignored. this feature further protects the device from inadvertent writes. additionally, while the memory is being programmed or erased, or when the status register is being written, all instructions except for read status register will be ignored until the program or erase cycle has completed. 7.2.1 manufacturer and device identification manufacturer id (mf7-mf0) winbond serial flash efh device id (id7-id0) (id15-id0) instruction abh, 90h 9fh w25q16cv 14h 4015h
w25q16cv - 20 - 7.2.2 instruction set table 1 (er ase, program instructions) (1) instruction name byte 1 (code) byte 2 byte 3 byte 4 byte 5 byte 6 write enable 06h write enable for volatile status register 50h write disable 04h read status register-1 05h (s7?s0) (2) read status register-2 35h (s15-s8) (2) write status register 01h (s7?s0) (s15-s8) page program 02h a23?a16 a15?a8 a7?a0 (d7?d0) quad page program 32h a23?a16 a15?a8 a7?a0 (d7?d0, ?) (3) sector erase (4kb) 20h a23?a16 a15?a8 a7?a0 block erase (32kb) 52h a23?a16 a15?a8 a7?a0 block erase (64kb) d8h a23?a16 a15?a8 a7?a0 chip erase c7h/60h erase / program suspend 75h erase / program resume 7ah power-down b9h continuous read mode reset (4) ffh ffh notes: 1. data bytes are shifted with most significant bit first. byte fields with data in parenthesis ?()? indicate data being read from the device on the do pin. 2. the status register contents will repeat cont inuously until /cs terminates the instruction. 3. quad page program input data: io0 = (d4, d0, ??) io1 = (d5, d1, ??) io2 = (d6, d2, ??) io3 = (d7, d3, ??) 4. this instruction is recommended when using the dual or quad ?continuous read mode? feature. see section 7.2.19 & 7.2.20 for more information.
w25q16cv publication release date: april 01, 2011 - 21 - revision c 7.2.3 instruction set table 2 (read instructions) instruction name byte 1 (code) byte 2 byte 3 byte 4 byte 5 byte 6 read data 03h a23-a16 a15-a8 a7-a0 (d7-d0) fast read 0bh a23-a16 a15-a8 a7-a0 dummy (d7-d0) fast read dual output 3bh a23-a16 a15-a8 a7-a0 dummy (d7-d0, ?) (1) fast read quad output 6bh a23-a16 a15-a8 a7-a0 dummy (d7-d0, ?) (3) fast read dual i/o bbh a23-a8 (2) a7-a0, m7-m0 (2) (d7-d0, ?) (1) fast read quad i/o ebh a23-a0, m7-m0 (4) (x,x,x,x, d7-d0, ?) (5) (d7-d0, ?) (3) word read quad i/o (7) e7h a23-a0, m7-m0 (4) (x,x, d7-d0, ?) (6) (d7-d0, ?) (3) octal word read quad i/o (8) e3h a23-a0, m7-m0 (4) (d7-d0, ?) (3) set burst with wrap 77h xxxxxx, w6-w4 (4) notes: 1. dual output data io0 = (d6, d4, d2, d0) io1 = (d7, d5, d3, d1) 2. dual input address io0 = a22, a20, a18, a16, a14, a12, a10, a8 a6, a4, a2, a0, m6, m4, m2, m0 io1 = a23, a21, a19, a17, a15, a13, a11, a9 a7, a5, a3, a1, m7, m5, m3, m1 3. quad output data io0 = (d4, d0, ?..) io1 = (d5, d1, ?..) io2 = (d6, d2, ?..) io3 = (d7, d3, ?..) 4. quad input address set burst with wrap input io0 = a20, a16, a12, a8, a4, a0, m4, m0 io0 = x, x, x, x, x, x, w4, x io1 = a21, a17, a13, a9, a5, a1, m5, m1 io1 = x, x, x, x, x, x, w5, x io2 = a22, a18, a14, a10, a6, a2, m6, m2 io2 = x, x, x, x, x, x, w6 x , io3 = a23, a19, a15, a11, a7, a3, m7, m3 io3 = x, x, x, x, x, x, x, x 5. fast read quad i/o data io0 = (x, x, x, x, d4, d0, ?..) io1 = (x, x, x, x, d5, d1, ?..) io2 = (x, x, x, x, d6, d2, ?..) io3 = (x, x, x, x, d7, d3, ?..) 6. word read quad i/o data io0 = (x, x, d4, d0, ?..) io1 = (x, x, d5, d1, ?..) io2 = (x, x, d6, d2, ?..) io3 = (x, x, d7, d3, ?..) 7. the lowest address bit must be 0. ( a0 = 0 ) 8. the lowest 4 address bits must be 0. ( a0, a1, a2, a3 = 0 )
w25q16cv - 22 - 7.2.4 instruction set table 3 (id, security instructions) instruction name byte 1 (code) byte 2 byte 3 byte 4 byte 5 byte 6 release power down / device id abh dummy dummy dummy (id7-id0) (1) manufacturer/ device id (2) 90h dummy dummy 00h (mf7-mf0) (id7-id0) manufacturer/device id by dual i/o 92h a23-a8 a7-a0, m[7:0] (mf[7:0], id[7:0]) manufacture/device id by quad i/o 94h a23-a0, m[7:0] xxxx, (mf[7:0], id[7:0]) (mf[7:0], id[7:0], ?) jedec id 9fh (mf7-mf0) manufacturer (id15-id8) memory type (id7-id0) capacity read unique id 4bh dummy dummy dummy dummy (id63-id0) read sfdp register 5ah 00h 00h a7?a0 dummy (d7-0) erase security registers (3) 44h a23?a16 a15?a8 a7?a0 program security registers (3) 42h a23?a16 a15?a8 a7?a0 (d7-0) (d7-0) read security registers (3) 48h a23?a16 a15?a8 a7?a0 dummy (d7-0) notes: 1. the device id will repeat continuously until /cs terminates the instruction. 2. see manufacturer and device identification table for device id information. 3. security register address: security register 1: a23-16 = 00h; a15-8 = 10h; a7-0 = byte address security register 2: a23-16 = 00h; a15-8 = 20h; a7-0 = byte address security register 3: a23-16 = 00h; a15-8 = 30h; a7-0 = byte address
w25q16cv publication release date: april 01, 2011 - 23 - revision c (io 0 ) do (io 1 ) 7.2.5 write enable (06h) the write enable instruction (figure 4) sets the write enable latch (wel) bit in the status register to a 1. the wel bit must be set prior to every page program, quad page program, sector erase, block erase, chip erase, write status register and erase/ program security registers instruction. the write enable instruction is entered by driving /cs low, shifting the instruction code ?06h? into the data input (di) pin on the rising edge of clk, and then driving /cs high. /cs clk di mode 0 mode 3 0 1 2 3 4 5 6 7 mode 0 mode 3 instruction (06h) high impedance figure 4. write enable instruction sequence diagram 7.2.6 write enable for volatile status register (50h) the non-volatile status register bits described in section 7.1 can also be written to as volatile bits. this gives more flexibility to change the system configuration and memory protection schemes quickly without waiting for the typical non-volatile bit write cycles or affecting the endurance of the status register non- volatile bits. to write the volatile values into the st atus register bits, the write enable for volatile status register (50h) instruction must be issued prior to a write status register (01h) instruction. write enable for volatile status register instruction (figure 5) will not set the write enable latch (wel) bit, it is only valid for the write status register instruction to change the volatile status register bit values. /cs clk di (io 0 ) do (io 1 ) mode 0 mode 3 0 1 2 3 4 5 6 7 mode 0 mode 3 instruction (50h) high impedance figure 5. write enable for volatile status register instruction sequence diagram
w25q16cv - 24 - (io 1 ) 7.2.7 write disable (04h) the write disable instruction (figure 6) resets the wr ite enable latch (wel) bit in the status register to a 0. the write disable instruction is entered by driving /cs low, shifting the instruction code ?04h? into the di pin and then driving /cs high. note that the wel bit is automatically reset after power-up and upon completion of the write status register, erase/program security registers, page program, quad page program, sector erase, block erase and chip erase instructions. write disable instruction can also be used to invali date the write enable for volatile status register instruction. /cs clk di (io 0 ) do mode 0 mode 3 0 1 2 3 4 5 6 7 mode 0 mode 3 instruction (04h) high impedance figure 6. write disable instruction sequence diagram
w25q16cv publication release date: april 01, 2011 - 25 - revision c (io 1 ) 7.2.8 read status register-1 (05h) a nd read status register-2 (35h) the read status register instructions allow the 8-bit status registers to be read. the instruction is entered by driving /cs low and shifting the instruction code ?05h? for status register-1 or ?35h? for status register-2 into the di pin on the rising edge of clk. the status register bits are then shifted out on the do pin at the falling edge of clk with most significant bit (msb) first as shown in figure 7. the status register bits are shown in figure 3a and 3b and include the busy, wel, bp2-bp0, tb, sec, srp0, srp1, qe, lb[3:1], cmp and sus bits (see status register section earlier in this datasheet). the read status register instruction may be used at any time, even while a program, erase or write status register cycle is in progress. this allows the busy status bit to be checked to determine when the cycle is complete and if the device can accept another instruction. the status register can be read continuously, as shown in figure 7. the instruction is completed by driving /cs high. /cs clk di (io 0 ) do mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (05h or 35h) high impedance 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 status register 1 or 2 out status register 1 or 2 out ** = msb * figure 7. read status register instruction sequence diagram 7.2.9 write status register (01h) the write status register instruction allows the stat us register to be written. only non-volatile status register bits srp0, sec, tb, bp2, bp1, bp0 (bits 7 th ru 2 of status register-1) and cmp, lb3, lb2, lb1, qe, srp1 (bits 14 thru 8 of status register-2 ) can be written to. all other status register bit locations are read-only and will not be affected by the write status register instruction. lb[3:1] are non- volatile otp bits, once it is set to 1, it can not be cleared to 0. the status register bits are shown in figure 3 and described in 7.1. to write non-volatile status register bits, a standard write enable (06h) instruction must previously have been executed for the device to accept the write status register instruction (status register bit wel must equal 1). once write enabled, the instruction is entered by driving /cs low, sending the instruction code ?01h?, and then writing the status register data byte as illustrated in figure 8. to write volatile status register bits, a write enable for volatile status register (50h) instruction must have been executed prior to the write status register instruction (status register bit wel remains 0). however, srp1 and lb3, lb2, lb1 can not be changed from ?1? to ?0? because of the otp protection for these bits. upon power off, the volatile status regist er bit values will be lost, and the non-volatile status register bit values will be restored when power on again.
w25q16cv - 26 - (io 1 ) to complete the write status register instruction, the /cs pin must be driven high after the eighth or sixteenth bit of data that is clocked in. if this is not done the write status register instruction will not be executed. if /cs is driven high after the eighth clock (compatible with the 25x series) the cmp and qe bits will be cleared to 0. during non-volatile status register write operation (06h combined with 01h), after /cs is driven high, the self-timed write status register cycle will commence for a time duration of t w (see ac characteristics). while the write status register cycle is in progress, the read status register instruction may still be accessed to check the status of the busy bit. the busy bit is a 1 during the write status register cycle and a 0 when the cycle is finished and ready to accept other instructions again. after the write status register cycle has finished, the write enable latch (wel) bit in the status register will be cleared to 0. during volatile status register write operation (50h combined with 01h), after /cs is driven high, the status register bits will be refreshed to the new values within the time period of t shsl2 (see ac characteristics). busy bit will remain 0 during the status register bit refresh period. please refer to 7.1 for detailed status register bit de scriptions. factory default for all status register bits are 0. /cs clk di (io 0 ) do mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (01h) high impedance 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 7 6 5 4 3 2 1 0 15 14 13 12 11 10 9 8 status register 1 in status register 2 in mode 0 mode 3 ** = msb * figure 8. write status register instruction sequence diagram
w25q16cv publication release date: april 01, 2011 - 27 - revision c do (io 1 ) 7.2.10 read data (03h) the read data instruction allows one or more data bytes to be sequentially read from the memory. the instruction is initiated by driving the /cs pin low and then shifting the instruction code ?03h? followed by a 24-bit address (a23-a0) into the di pin. the code and address bits are latched on the rising edge of the clk pin. after the address is received, the data byte of the addressed memory location will be shifted out on the do pin at the falling edge of clk with most significant bit (msb) first. the address is automatically incremented to the next higher address after each byte of data is shifted out allowing for a continuous stream of data. this means that the entire memory can be accessed with a single instruction as long as the clock continues. the instruction is completed by driving /cs high. the read data instruction sequence is shown in figure 9. if a read data instruction is issued while an erase, program or write cycle is in process (busy=1) the instruction is ignored and will not have any effects on the current cycle. the read data instruction allows clock rates from d.c. to a maximum of f r (see ac electrical characteristics). /cs clk di (io 0 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (03h) high impedance 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39 7 6 5 4 3 2 1 0 7 24-bit address 23 22 21 3 2 1 0 data out 1 * * = msb * figure 9. read data instruction sequence diagram
w25q16cv - 28 - 7.2.11 fast read (0bh) the fast read instruction is similar to the read data instruction except that it can operate at the highest possible frequency of f r (see ac electrical characteristics). this is accomplished by adding eight ?dummy? clocks after the 24-bit address as shown in figure 10. the dummy clocks allow the devices internal circuits additional time for setting up the in itial address. during the dummy clocks the data value on the do pin is a ?don?t care?. /cs clk di (io 0 ) do (io 1 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (0bh) high impedance 8 9 10 28 29 30 31 24-bit address 23 22 21 3 2 1 0 data out 1 0 do (io 1 ) * /cs clk di (io ) 32 33 34 35 36 37 38 39 dummy clocks 40 41 42 44 45 46 47 48 49 50 51 52 53 54 55 high impedance 7 6 5 4 3 2 1 0 7 data out 2 * 7 6 5 4 3 2 1 0 * 43 31 0 = msb * figure 10. fast read instruction sequence diagram
w25q16cv publication release date: april 01, 2011 - 29 - revision c 7.2.12 fast read dual output (3bh) the fast read dual output (3bh) instruction is similar to the standard fast read (0bh) instruction except that data is output on two pins; io 0 and io 1 . this allows data to be transferred from the w25q16cv at twice the rate of standard spi devices. the fast read dual output instruction is ideal for quickly downloading code from flash to ram upon power-up or for applications that cache code-segments to ram for execution. similar to the fast read instruction, the fast r ead dual output instruction can operate at the highest possible frequency of f r (see ac electrical characteristics). this is accomplished by adding eight ?dummy? clocks after the 24-bit address as shown in figure 11. the dummy clocks allow the device's internal circuits additional time for setting up the init ial address. the input data during the dummy clocks is ?don?t care?. however, the io 0 pin should be high-impedance prior to the falling edge of the first data out clock. /cs clk di (io 0 ) do (io 1 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (3bh) high impedance 8 9 10 28 29 30 32 33 34 35 36 37 38 39 6 4 2 0 24-bit address 23 22 21 3 2 1 0 * * 31 31 /cs clk di (io 0 ) do (io 1 ) dummy clocks 0 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 7 5 3 1 6 4 2 0 6 4 2 0 6 4 2 0 high impedance 7 5 3 1 7 5 3 1 7 5 3 1 io 0 switches from input to output 6 7 data out 1 * data out 2 * data out 3 * data out 4 = msb * figure 11. fast read dual output instruction sequence diagram
w25q16cv - 30 - 7.2.13 fast read quad output (6bh) the fast read quad output (6bh) instruction is similar to the fast read dual output (3bh) instruction except that data is output on four pins, io 0 , io 1 , io 2 , and io 3 . a quad enable of status register-2 must be executed before the device will accept the fast read quad output instruction (status register bit qe must equal 1). the fast read quad output instruction allows data to be transferred from the w25q16cv at four times the rate of standard spi devices. the fast read quad output instruction can operate at the highest possible frequency of f r (see ac electrical characteristics). this is accomplished by adding eight ?dummy? clocks after the 24-bit address as shown in figure 12. the dummy clocks allow the dev ice's internal circuits additional time for setting up the initial address. the input data during the dummy clocks is ?don?t care?. however, the io pins should be high-impedance prior to the falling edge of the first data out clock. /cs clk mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (6bh) high impedance 8 9 10 28 29 30 32 33 34 35 36 37 38 39 4 0 24-bit address 23 22 21 3 2 1 0 * 31 31 /cs clk dummy clocks 0 40 41 42 43 44 45 46 47 5 1 high impedance 4 5 high impedance high impedance 6 2 7 3 high impedance high impedance 4 0 5 1 6 2 7 3 4 0 5 1 6 2 7 3 4 0 5 byte 1 6 7 1 6 2 7 3 byte 2 byte 3 byte 4 io 0 switches from input to output io 0 io 1 io 2 io 3 io 0 io 1 io 2 io 3 = msb * figure 12. fast read quad output instruction sequence diagram
w25q16cv publication release date: april 01, 2011 - 31 - revision c 7.2.14 fast read dual i/o (bbh) the fast read dual i/o (bbh) instruction allows for improved random access while maintaining two io pins, io 0 and io 1 . it is similar to the fast read dual output (3bh) instruction but with the capab ility to input the address bits (a23-0) two bits per clock. this reduced instruction overhead may allow for code execution (xip) directly from the dual spi in some applications. fast read dual i/o with ?continuous read mode? the fast read dual i/o instruction can further reduce instruction overhead through setting the ?continuous read mode? bits (m7-0) after the input address bits (a23-0), as shown in figure 13a. the upper nibble of the (m7-4) controls the length of the next fast read dual i/o instruction through the inclusion or exclusion of the first byte instruction c ode. the lower nibble bits of the (m3-0) are don?t care (?x?). however, the io pins should be high-impedance prior to the falling edge of the first data out clock. if the ?continuous read mode? bits m5-4 = (1,0), then the next fast read dual i/o instruction (after /cs is raised and then lowered) does not require the bbh instruction code, as shown in figure 13b. this r educes the instruction sequence by eight clocks and allows the read address to be immediately entered after /cs is asserted low. if the ?continuous read mode? bits m5-4 do not equal to (1,0), the next instruction (after /cs is raised and then lowered) requires the first byte instruction code, thus returning to normal operation. a ?continuous read mode? reset instruction can also be used to reset (m7-0) before issuing normal instructions (see 7.2.20 for detail descriptions). /cs clk di (io 0 ) do (io 1 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (bbh) 8 9 10 12 13 14 24 25 26 27 28 29 30 31 6 4 2 0 * * 23 /cs clk di (io 0 ) do (io 1 ) 0 32 33 34 35 36 37 38 39 7 5 3 1 * 6 4 2 0 7 5 3 1 6 4 2 0 7 5 3 1 6 4 2 0 7 5 3 1 ** ios switch from input to output 6 7 22 20 18 16 23 21 19 17 14 12 10 8 15 13 11 9 6 4 2 0 7 5 3 1 6 4 2 0 7 5 3 1 11 15 16 17 18 20 21 22 19 23 1 a23-16 a15-8 a7-0 m7-0 byte 1 byte 2 byte 3 byte 4 = msb * * figure 13a. fast read dual i/o instruction sequence (initial instruction or previous m5-4 10)
w25q16cv - 32 - /cs clk di (io 0 ) do (io 1 ) mode 0 mode 3 8 9 10 11 12 13 14 15 24 25 26 27 28 29 30 31 6 4 2 0 * * 15 /cs clk di (io 0 ) do (io 1 ) 0 7 5 3 1 * 6 4 2 0 7 5 3 1 6 4 2 0 7 5 3 1 6 4 2 0 7 5 3 1 ** ios switch from input to output 6 7 22 20 18 16 23 21 19 17 14 12 10 8 15 13 11 9 6 4 2 0 7 5 3 1 6 4 2 0 7 5 3 1 a23-16 a15-8 a7-0 m7-0 b y t e 1b y t e 2b y t e 3b y t e 4 01234567 16 17 18 20 21 22 19 23 * = msb * 1 figure 13b. fast read dual i/o instruction sequence (previous instruction set m5-4 = 10)
w25q16cv publication release date: april 01, 2011 - 33 - revision c m7-0 /cs clk 7.2.15 fast read quad i/o (ebh) the fast read quad i/o (ebh) instruction is similar to the fast read dual i/o (bbh) instruction except that address and data bits are input and output through four pins io 0 , io 1 , io 2 and io 3 and four dummy clock are required prior to the data output . the quad i/o dramatically reduces instruction overhead allowing faster random access for code execution (xip) directly from the quad spi. the quad enable bit (qe) of status register-2 must be set to enable the fast read quad i/o instruction. fast read quad i/o with ?continuous read mode? the fast read quad i/o instruction can further reduce instruction overhead through setting the ?continuous read mode? bits (m7-0) after the input address bits (a23-0), as shown in figure 14a. the upper nibble of the (m7-4) controls the length of the next fast read quad i/o instruction through the inclusion or exclusion of the first byte instruction c ode. the lower nibble bits of the (m3-0) are don?t care (?x?). however, the io pins should be high-impedance prior to the falling edge of the first data out clock. if the ?continuous read mode? bits m5-4 = (1,0), then the next fast read quad i/o instruction (after /cs is raised and then lowered) does not require the ebh instruction code, as shown in figure 14b. this reduces the instruction sequence by eight clocks and allows the read address to be immediately entered after /cs is asserted low. if the ?continuous read mode? bits m5-4 do not equal to (1,0), the next instruction (after /cs is raised and then lowered) requires the first byte instruction code, thus returning to normal operation. a ?continuous read mode? reset instruction can also be used to reset (m7-0) before issuing normal instructions (see 7.2.20 for detail descriptions). figure 14a. fast read quad i/o instruction sequence (initial instruction or previous m5-4 10) mode 0 mode 3 0 1 io 0 io 1 io 2 io 3 2 3 4 5 20 16 12 8 21 17 22 18 23 19 13 9 14 10 15 11 a23-16 6 7 8 9 4 0 5 1 6 2 7 3 a15-8 a7-0 byte 1 byte 2 4 0 5 1 6 2 7 3 4 0 5 1 6 2 7 3 4 0 5 1 6 2 7 3 10 11 12 13 14 4 5 6 7 15 ios switch from input to output byte 3 16 17 18 19 20 21 22 23 dummy dummy instruction (ebh)
w25q16cv - 34 - m7-0 /cs clk mode 0 mode 3 0 1 io 0 io 1 2 io 2 io 3 3 4 5 20 16 12 8 21 17 22 18 23 19 13 9 14 10 15 11 a23-16 6 7 8 9 4 0 5 1 6 2 7 3 a15-8 a7-0 4 byte 1 byte 2 0 5 1 4 0 5 1 4 0 5 1 10 11 12 13 14 4 5 6 2 7 3 6 2 7 3 6 2 6 7 3 7 ios switch from input to output byte 3 15 dummy dummy figure 14b. fast read quad i/o instruction sequence (previous instruction set m5-4 = 10) fast read quad i/o with ?8 /16/32/64-byte wrap around? the fast read quad i/o instruction can also be used to access a specific portion within a page by issuing a ?set burst with wrap? command prior to ebh. the ?set burst with wrap? command can either enable or disable the ?wrap around? feature for the following ebh commands. when ?wrap around? is enabled, the data being accessed can be limited to either an 8, 16, 32 or 64-byte section of a 256-byte page. the output data starts at the initial address specified in the instruction, once it reaches the ending boundary of the 8/16/32/64-byte section, the output will wrap around to the beginning boundary automatically until /cs is pulled high to terminate the command. the burst with wrap feature allows applications that use cache to quickly fetch a critical address and then fill the cache afterwards within a fixed length (8/16/32/64-byte) of data without issuing multiple read commands. the ?set burst with wrap? instruction allows three ?wrap bits?, w6-4 to be set. the w4 bit is used to enable or disable the ?wrap around? operation while w6-5 are used to specify the length of the wrap around section within a page. see 7.2.18 for detail descriptions.
w25q16cv publication release date: april 01, 2011 - 35 - revision c m7-0 /cs clk 7.2.16 word read quad i/o (e7h) the word read quad i/o (e7h) instruction is similar to the fast read quad i/o (ebh) instruction except that the lowest address bit (a0) must equal 0 and only two dummy clocks are required prior to the data output. the quad i/o dramatically reduces instruction overhead allowing faster random access for code execution (xip) directly from the quad spi. the quad e nable bit (qe) of status register-2 must be set to enable the word read quad i/o instruction. word read quad i/o with ?continuous read mode? the word read quad i/o instruction can further reduce instruction overhead through setting the ?continuous read mode? bits (m7-0) after the input address bits (a23-0), as shown in figure 15a. the upper nibble of the (m7-4) controls the length of the next fast read quad i/o instruction through the inclusion or exclusion of the first byte instruction c ode. the lower nibble bits of the (m3-0) are don?t care (?x?). however, the io pins should be high-impedance prior to the falling edge of the first data out clock. if the ?continuous read mode? bits m5-4 = (1,0), then the next fast read quad i/o instruction (after /cs is raised and then lowered) does not require the e7h instruction code, as shown in figure 15b. this reduces the instruction sequence by eight clocks and allows the read address to be immediately entered after /cs is asserted low. if the ?continuous read mode? bits m5-4 do not equal to (1,0), the next instruction (after /cs is raised and then lowered) requires the first byte instruction code, thus returning to normal operation. a ?continuous read mode? reset instruction can also be used to reset (m7-0) before issuing normal instructions (see 7.2.20 for detail descriptions). figure 15a. word read quad i/o instruction sequence (initial instruction or previous m5-4 10) mode 0 mode 3 0 1 io 0 io 1 io 2 io 3 2 3 4 5 20 16 12 8 21 17 22 18 23 19 13 9 14 10 15 11 a23-16 6 7 8 9 4 0 5 1 6 2 7 3 a15-8 a7-0 byte 1 byte 2 4 0 5 1 6 2 7 3 4 0 5 1 6 2 7 3 4 0 5 1 6 2 7 3 10 11 12 13 14 4 5 6 7 15 ios switch from input to output byte 3 16 17 18 19 20 21 instruction (e7h) dummy
w25q16cv - 36 - m7-0 /cs clk mode 0 mode 3 0 1 io 0 io 1 2 io 2 io 3 3 4 5 20 16 12 8 21 17 22 18 23 19 13 9 14 10 15 11 a23-16 6 7 4 0 5 1 6 2 7 3 a15-8 a7-0 4 0 5 1 6 2 7 3 byte 1 byte 2 4 0 5 1 4 0 5 1 4 6 2 7 3 6 2 7 3 5 6 7 ios switch from input to out put byte 3 8 9 10 11 12 13 dummy figure 15b. word read quad i/o instruction sequence (previous instruction set m5-4 = 10) word read quad i/o with ?8/16/32/64-byte wrap around? the word read quad i/o instruction can also be used to access a specific portion within a page by issuing a ?set burst with wrap? command prior to e7h. the ?set burst with wrap? command can either enable or disable the ?wrap around? feature for the following e7h commands. when ?wrap around? is enabled, the data being accessed can be limited to either an 8, 16, 32 or 64-byte section of a 256-byte page. the output data starts at the initial address specified in the instruction, once it reaches the ending boundary of the 8/16/32/64-byte section, the output will wrap around to the beginning boundary automatically until /cs is pulled high to terminate the command. the burst with wrap feature allows applications that use cache to quickly fetch a critical address and then fill the cache afterwards within a fixed length (8/16/32/64-byte) of data without issuing multiple read commands. the ?set burst with wrap? instruction allows three ?wrap bits?, w6-4 to be set. the w4 bit is used to enable or disable the ?wrap around? operation while w6-5 are used to specify the length of the wrap around section within a page. see 7.2.18 for detail descriptions.
w25q16cv publication release date: april 01, 2011 - 37 - revision c 7.2.17 octal word read quad i/o (e3h) the octal word read quad i/o (e3h) instruction is similar to the fast read quad i/o (ebh) instruction except that the lower four address bits (a0, a1, a2, a3) must equal 0. as a result, the dummy clocks are not required, which further reduces the instruction overhead allowing even faster random access for code execution (xip). the quad enable bit (qe) of status register-2 must be set to enable the octal word read quad i/o instruction. octal word read quad i/o with ?continuous read mode? the octal word read quad i/o instruction can further reduce instruction overhead through setting the ?continuous read mode? bits (m7-0) after the input address bits (a23-0), as shown in figure 16a. the upper nibble of the (m7-4) controls the length of the next octal word read quad i/o instruction through the inclusion or exclusion of the first byte instruct ion code. the lower nibble bits of the (m3-0) are don?t care (?x?). however, the io pins should be high-impedance prior to the falling edge of the first data out clock. if the ?continuous read mode? bits m5-4 = (1,0), then the next fast read quad i/o instruction (after /cs is raised and then lowered) does not require the e3h instruction code, as shown in figure 16b. this reduces the instruction sequence by eight clocks and allows the read address to be immediately entered after /cs is asserted low. if the ?continuous read mode? bits m5-4 do not equal to (1,0), the next instruction (after /cs is raised and then lowered) requires the first byte instruction code, thus returning to normal operation. a ?continuous read mode? reset instruction can also be used to reset (m7-0) before issuing normal instructions (see 7.2.20 for detail descriptions). m7-0 /cs clk mode 0 mode 3 0 1 io 0 io 1 io 2 io 2 3 3 4 5 20 16 12 8 21 17 22 18 23 19 13 9 14 10 15 11 a23-16 6 7 8 9 4 0 5 1 6 2 7 3 a15-8 a7-0 4 byte 1 byte 2 0 5 1 6 2 7 3 4 0 5 1 6 2 7 3 4 0 5 1 6 2 7 3 10 11 12 13 14 4 5 6 7 ios switch from input to output byte 3 15 16 17 18 19 20 21 instruction (e3h) 4 0 5 1 6 2 7 3 byte 4 figure 16a. octal word read quad i/o instruction sequence (initial instruction or previous m5-4 10)
w25q16cv - 38 - m7-0 /cs clk mode 0 mode 3 0 1 io 0 io 1 2 io 2 io 3 3 4 5 20 16 12 8 21 17 22 18 23 19 13 9 14 10 15 11 a23-16 6 7 4 0 5 1 6 2 7 3 a15-8 a7-0 4 0 5 1 6 2 7 3 byte 1 byte 2 4 0 5 1 4 0 5 1 6 2 7 3 6 2 7 3 4 5 6 7 ios switch from input to output byte 3 8 9 10 11 12 13 4 0 5 1 6 2 7 3 byte 4 figure 16b. octal word read quad i/o instruction sequence (previous instruction set m5-4 = 10)
w25q16cv publication release date: april 01, 2011 - 39 - revision c 7.2.18 set burst with wrap (77h) the set burst with wrap (77h) instruction is used in conjunction with ?fast read quad i/o? and ?word read quad i/o? instructions to access a fixed length of 8/16/32/64-byte section within a 256-byte page. certain applications can benefit from this feature and improve the overall system code execution performance. similar to a quad i/o instruction, the set burst with wrap instruction is initiated by driving the /cs pin low and then shifting the instruction code ?77h? followed by 24 dummy bits and 8 ?wrap bits?, w7-0. the instruction sequence is shown in figure 17. wrap bit w7 and the lower nibble w3-0 are not used. w6, w5 w4 = 0 w4 =1 (default) wrap around wrap length wrap around wrap length 0 0 yes 8-byte no n/a 0 1 yes 16-byte no n/a 1 0 yes 32-byte no n/a 1 1 yes 64-byte no n/a once w6-4 is set by a set burst with wrap instruction, all the following ?fast read quad i/o? and ?word read quad i/o? instructions will use the w6-4 setting to access the 8/16/32/64-byte section within any page. to exit the ?wrap around? function and return to normal read operation, another set burst with wrap instruction should be issued to set w4 = 1. the default value of w4 upon power on is 1. in the case of a system reset while w4 = 0, it is recommended that the controller issues a set burst with wrap instruction to reset w4 = 1 prior to any normal read instructions since w25q16cv does not have a hardware reset pin. wrap bit /cs clk mode 0 mode 3 0 1 io 0 io 1 io 2 io 3 2 3 4 5 x x x x x x x x don't care 6 7 8 9 don't care don't care 10 11 12 13 14 15 instruction (77h) mode 0 mode 3 x x x x x x x x x x x x x x x x w4 x w5 x w6 x x x figure 17. set burst with wrap instruction sequence
w25q16cv - 40 - 7.2.19 continuous read mode bits (m7-0) the ?continuous read mode? bits are used in conjunction with ?fast read dual i/o?, ?fast read quad i/o?, ?word read quad i/o? and ?octal word read quad i/o? instructions to provide the highest random flash memory access rate with minimum spi instruction overhead, thus allow true xip (execute in place) to be performed on serial flash devices. m7-0 need to be set by the dual/quad i/o read instructions. m5-4 are used to control whether the 8-bit spi instruction code (bbh, ebh, e7h or e3h) is needed or not for the next command. when m5-4 = (1,0), the next command will be treated same as the current dual/quad i/o read command without needing the 8-bit instruction code; when m5-4 do not equal to (1,0), the device returns to normal spi mode, all commands can be accepted. m7-6 and m3-0 are reserved bits for future use, either 0 or 1 values can be used. 7.2.20 continuous read mode reset (ffh or ffffh) continuous read mode reset instruction can be used to set m4 = 1, thus the device will release the continuous read mode and return to normal spi operation, as shown in figure 18. /cs clk mode 0 mode 3 0 1 io 0 io 1 io 2 2 io 3 3 4 5 don't care 6 7 8 9 10 11 12 13 14 15 mode bit reset for quad i/o (ffh) mode 0 mode 3 mode bit reset for dual i/o (ffffh) don't care don't care figure 18. continuous read mode reset for fast read dual/quad i/o since w25q16cv does not have a hardware reset pin, so if the controller resets while w25q16cv is set to continuous mode read, the w25q16cv will not recogni ze any initial standard spi instructions from the controller. to address this possibility, it is recommended to issue a continuous read mode reset instruction as the first instruction after a system reset. doing so will release the device from the continuous read mode and allow standard spi instructions to be recognized. to reset ?continuous read mode? during quad i/o operation, only eight clocks are needed. the instruction is ?ffh?. to reset ?continuous read mode? during dual i/o operation, sixteen clocks are needed to shift in instruction ?ffffh?.
w25q16cv publication release date: april 01, 2011 - 41 - revision c 7.2.21 page program (02h) the page program instruction allows from one byte to 256 bytes (a page) of data to be programmed at previously erased (ffh) memory locations. a write enable instruction must be executed before the device will accept the page program instruction (status register bit wel= 1). the instruction is initiated by driving the /cs pin low then shifting the instruction code ?02h? followed by a 24-bit address (a23-a0) and at least one data byte, into the di pin. the /cs pin must be held low for the entire length of the instruction while data is being sent to the device. the page program instruction sequence is shown in figure 19. if an entire 256 byte page is to be programmed, the last address byte (the 8 least significant address bits) should be set to 0. if the last address byte is not zero, and the number of clocks exceed the remaining page length, the addressing will wrap to the beginning of the page. in some cases, less than 256 bytes (a partial page) can be programmed without having any effect on other bytes within the same page. one condition to perform a partial page program is that the number of clocks can not exceed the remaining page length. if more than 256 bytes are sent to the device the addressing will wrap to the beginning of the page and overwrite previously sent data. as with the write and erase instructions, the /cs pin must be driven high after the eighth bit of the last byte has been latched. if this is not done the page program instruction will not be executed. after /cs is driven high, the self-timed page program instruction will commence for a time duration of tpp (see ac characteristics). while the page program cycle is in progress, the read status register instruction may still be accessed for checking the status of the busy bit. the busy bit is a 1 during the page program cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions again. after the page program cycle has finished the write enable latch (wel) bit in the status register is cleared to 0. the page program instruction will not be executed if the addressed page is protected by the block protect (cmp, sec, tb, bp2, bp1, and bp0) bits. /cs clk di (io 0 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (02h) 8 9 10 28 29 30 39 24-bit address 23 22 21 3 2 1 * /cs clk 40 di (io 0 ) 41 42 43 44 45 46 47 data byte 2 48 49 50 52 53 54 55 2072 51 39 7 6 5 4 3 2 1 0 0 31 0 32 33 34 35 36 37 38 data byte 1 7 6 5 4 3 2 1 * mode 0 mode 3 data byte 3 2073 2074 2075 2076 2077 2078 2079 0 data byte 256 * 7 6 5 4 3 2 1 0 * 7 = msb * 6 5 4 3 2 1 0 * figure 19. page program instruction sequence diagram
w25q16cv - 42 - 7.2.22 quad input page program (32h) the quad page program instruction allows up to 256 bytes of data to be programmed at previously erased (ffh) memory locations using four pins: io 0 , io 1 , io 2 , and io 3 . the quad page program can improve performance for prom programmer and applications that have slow clock speeds <5mhz. systems with faster clock speed will not realize much benefit for the quad page program instruction since the inherent page program time is much greater than the time it take to clock-in the data. to use quad page program the quad enable in status register-2 must be set (qe=1). a write enable instruction must be executed before the device will accept the quad page program instruction (status register-1, wel=1). the instruction is initiated by driving the /cs pin low then shifting the instruction code ?32h? followed by a 24-bit address (a23-a0) and at least one data byte, into the io pins. the /cs pin must be held low for the entire length of the instruction while data is being sent to the device. all other functions of quad page program are identical to standard page program. the quad page program instruction sequence is shown in figure 20. /cs clk mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (32h) 8 9 10 28 29 30 32 33 34 35 36 37 4 0 24-bit address 23 22 21 3 2 1 0 * 31 31 /cs clk 5 1 byte 1 6 2 7 3 4 0 5 1 6 2 7 3 4 0 5 1 6 2 7 3 4 0 5 1 6 2 7 3 byte 2 byte 3 byte 256 0 4 0 5 1 6 2 7 3 4 0 5 1 6 2 7 3 4 0 5 1 6 2 7 3 536 537 538 539 540 541 542 543 mode 0 mode 3 byte 253 byte 254 byte 255 io 0 io 1 io 2 io io 0 io 1 io 2 io 3 = msb * 3 *** **** figure 20. quad input page program instruction sequence diagram
w25q16cv publication release date: april 01, 2011 - 43 - revision c do (io 1 ) 7.2.23 sector erase (20h) the sector erase instruction sets all memory within a specified sector (4k-bytes) to the erased state of all 1s (ffh). a write enable instruction must be executed before the device will accept the sector erase instruction (status register bit wel must equal 1). the instruction is initiated by driving the /cs pin low and shifting the instruction code ?20h? followed a 24-bit sector address (a23-a0) (see figure 2). the sector erase instruction sequence is shown in figure 21. the /cs pin must be driven high after the eighth bit of the last byte has been latched. if this is not done the sector erase instruction will not be executed. after /cs is driven high, the self-timed sector erase instruction will commence for a time duration of t se (see ac characteristics). while the sector erase cycle is in progress, the read status register instruction may still be accessed for checking the status of the busy bit. the busy bit is a 1 during the sector erase cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions again. after the sector erase cycle has finished the write enable latch (wel) bit in the status register is cleared to 0. the sector erase instruction will not be executed if the addressed page is protected by the block protect (cmp, sec, tb, bp2, bp1, and bp0) bits (see status register memory protection table). /cs clk di (io 0 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (20h) high impedance 8 9 29 30 31 24-bit address 23 22 2 1 0 * mode 0 mode 3 = msb * figure 21. sector erase instruction sequence diagram
w25q16cv - 44 - do (io 1 ) 7.2.24 32kb block erase (52h) the block erase instruction sets all memory within a specified block (32k-bytes) to the erased state of all 1s (ffh). a write enable instruction must be executed before the device will accept the block erase instruction (status register bit wel must equal 1). the instruction is initiated by driving the /cs pin low and shifting the instruction code ?52h? followed a 24-bit block address (a23-a0) (see figure 2). the block erase instruction sequence is shown in figure 22. the /cs pin must be driven high after the eighth bit of the last byte has been latched. if this is not done the block erase instruction will not be executed. after /cs is driven high, the self-timed block erase instruction will commence for a time duration of t be 1 (see ac characteristics). while the block erase cycle is in progress, the read status register instruction may still be accessed for checking the status of the busy bit. the busy bit is a 1 during the block erase cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions again. after the block erase cycle has finished the write enable latch (wel) bit in the status register is cleared to 0. the block erase instruction will not be executed if the addressed page is protected by the block protect (cmp, sec, tb, bp2, bp1, and bp0) bits (see status register memory protection table). /cs clk di (io 0 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (52h) 8 9 29 30 31 24-bit address 23 22 2 1 0 high impedance * mode 0 mode 3 = msb * figure 22. 32kb block erase instruction sequence diagram
w25q16cv publication release date: april 01, 2011 - 45 - revision c do (io 1 ) 7.2.25 64kb block erase (d8h) the block erase instruction sets all memory within a specified block (64k-bytes) to the erased state of all 1s (ffh). a write enable instruction must be executed before the device will accept the block erase instruction (status register bit wel must equal 1). the instruction is initiated by driving the /cs pin low and shifting the instruction code ?d8h? followed a 24-bit block address (a23-a0) (see figure 2). the block erase instruction sequence is shown in figure 23. the /cs pin must be driven high after the eighth bit of the last byte has been latched. if this is not done the block erase instruction will not be executed. after /cs is driven high, the self-timed block erase instruction will commence for a time duration of t be (see ac characteristics). while the block erase cycle is in progress, the read status register instruction may still be accessed for checking the status of the busy bit. the busy bit is a 1 during the block erase cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions again. after the block erase cycle has finished the write enable latch (wel) bit in the status register is cleared to 0. the block erase instruction will not be executed if the addressed page is protected by the block protect (cmp, sec, tb, bp2, bp1, and bp0) bits (see status register memory protection table). /cs clk di (io 0 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (d8h) 8 9 29 30 31 24-bit address 23 22 2 1 0 high impedance * mode 0 mode 3 = msb * figure 23. 64kb block erase instruction sequence diagram
w25q16cv - 46 - do (io 1 ) 7.2.26 chip erase (c7h / 60h) the chip erase instruction sets all memory within the device to the erased state of all 1s (ffh). a write enable instruction must be executed before the device will accept the chip erase instruction (status register bit wel must equal 1). the instruction is initiated by driving the /cs pin low and shifting the instruction code ?c7h? or ?60h?. the chip erase instruction sequence is shown in figure 24. the /cs pin must be driven high after the eighth bit has been latched. if this is not done the chip erase instruction will not be executed. after /cs is driven high, the self-timed chip erase instruction will commence for a time duration of t ce (see ac characteristics). while the chip erase cycle is in progress, the read status register instruction may still be access ed to check the status of the busy bit. the busy bit is a 1 during the chip erase cycle and becomes a 0 when finished and the device is ready to accept other instructions again. after the chip erase cycle has finished the write enable latch (wel) bit in the status register is cleared to 0. the chip erase instruction will not be executed if any page is protected by the block protect (cmp, sec, tb, bp2, bp1, and bp0) bits (see status register memory protection table). /cs clk di (io 0 ) mode 0 mode 3 0 1 2 3 4 5 6 7 mode 0 mode 3 instruction (c7h/ 60h) high impedance figure 24. chip erase instruction sequence diagram
w25q16cv publication release date: april 01, 2011 - 47 - revision c 7.2.27 erase / program suspend (75h) the erase/program suspend instruction ?75h?, allows the system to interrupt a sector or block erase operation or a page program operation and then read from or program/erase data to, any other sectors or blocks. the erase/program suspend instruction sequence is shown in figure 25. the write status register instruction (01h) and erase instructions (20h, 52h, d8h, c7h, 60h, 44h) are not allowed during erase suspend. erase suspend is valid only during the sector or block erase operation. if written during the chip erase operation, the erase suspend instruction is ignored. the write status register instruction (01h) and program instructions (02h, 32h, 42h) are not allowed during program suspend. program suspend is valid only during the page program or quad page program operation. the erase/program suspend instruction ?75h? will be accepted by the device only if the sus bit in the status register equals to 0 and the busy bit equals to 1 while a sector or block erase or a page program operation is on-going. if the sus bit equals to 1 or the busy bit equals to 0, the suspend instruction will be ignored by the device. a maximum of time of ?t sus ? (see ac characteristics) is required to suspend the erase or program operation. the busy bit in the status register will be cleared from 1 to 0 within ?t sus ? and the sus bit in the status register will be set from 0 to 1 immediately after erase/program suspend. for a previously resumed erase/program operation, it is also required that the suspend instruction ?75h? is not issued earlier than a minimum of time of ?t sus ? following the preceding resume instruction ?7ah?. unexpected power off during the erase/program suspend state will reset the device and release the suspend state. sus bit in the status register will also reset to 0. the data within the page, sector or block that was being suspended may become corrupted. when the device is powered up again, it is recommended for the user to repeat the same erase or program operation that was interrupted, at the same address location, to avoid the potention data corruption. /cs clk di (io 0 ) do (io 1 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (75h) high impedance mode 0 mode 3 tsus accept instructions figure 25. erase/program suspend instruction sequence
w25q16cv - 48 - 7.2.28 erase / program resume (7ah) the erase/program resume instruction ?7ah? must be written to resume the sector or block erase operation or the page program operation after an erase/program suspend. the resume instruction ?7ah? will be accepted by the device only if the sus bit in the status register equals to 1 and the busy bit equals to 0. after issued the sus bit will be cleared from 1 to 0 immediately, the busy bit will be set from 0 to 1 within 200ns and the sector or block will complete the erase operation or the page will complete the program operation. if the sus bit equals to 0 or the busy bit equals to 1, the resume instruction ?7ah? will be ignored by the device. the erase/program resume instruction sequence is shown in figure 26. resume instruction is ignored if the previous erase/program suspend operation was interrupted by unexpected power off. it is also required that a subsequent erase/program suspend instruction not to be issued within a minimum of time of ?t sus ? following a previous resume instruction. /cs clk di (io 0 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (7ah) mode 0 mode 3 resume previously suspended program or erase figure 26. erase/program resume instruction sequence
w25q16cv publication release date: april 01, 2011 - 49 - revision c 7.2.29 power-down (b9h) although the standby current during normal operation is relatively low, standby current can be further reduced with the power-down instruction. the lower power consumption makes the power-down instruction especially useful for battery powered applications (see icc1 and icc2 in ac characteristics). the instruction is initiated by driving the /cs pin low and shifting the instruction code ?b9h? as shown in figure 27. the /cs pin must be driven high after the eighth bit has been latched. if this is not done the power-down instruction will not be executed. after /cs is driven high, the power-down state will entered within the time duration of t dp (see ac characteristics). while in the power-down state only the release from power- down / device id instruction, which restores the device to normal operation, will be recognized. all other instructions are ignored. this includes the read status register instruction, which is always available during normal operation. ignoring all but one instructi on makes the power down state a useful condition for securing maximum write protection. the device always powers-up in the normal operation with the standby current of icc1. /cs clk di (io 0 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (b9h) mode 0 mode 3 tdp power-down current stand-by current figure 27. deep power-down instruction sequence diagram
w25q16cv - 50 - 7.2.30 release power-down / device id (abh) the release from power-down / device id instruction is a multi-purpose instruction. it can be used to release the device from the power-down state, or obtai n the devices electronic identification (id) number. to release the device from the power-down state, the instruction is issued by driving the /cs pin low, shifting the instruction code ?abh? and driving /cs high as shown in figure 28a. release from power-down will take the time duration of t res1 (see ac characteristics) before the device will resume normal operation and other instructions are accepted. the /cs pin must remain high during the t res1 time duration. when used only to obtain the device id while not in t he power-down state, the instruction is initiated by driving the /cs pin low and shifting the instruction code ?abh? followed by 3-dummy bytes. the device id bits are then shifted out on the falling edge of clk with most significant bit (msb) first as shown in figure 28a. the device id values for the w25q16cv is list ed in manufacturer and device identification table. the device id can be read continuously. the instruction is completed by driving /cs high. when used to release the device from the power-down state and obtain the device id, the instruction is the same as previously described, and shown in figure 28b, except that after /cs is driven high it must remain high for a time duration of t res2 (see ac characteristics). after this time duration the device will resume normal operation and other instructions will be accepted. if the release from power-down / device id instruction is issued while an erase, program or write cycle is in process (when busy equals 1) the instruction is ignored and will not have any effects on the current cycle. /cs clk di (io 0 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (abh) mode 0 mode 3 tres1 power-down current stand-by curren t figure 28a. release power-down instruction sequence
w25q16cv publication release date: april 01, 2011 - 51 - revision c tres2 /cs clk di (io 0 ) do (io 1 ) mode 0 mode 3 0 1 2 3 4 5 6 7 mode 0 mode 3 8 9 29 30 31 instruction (abh) high impedance 3 dummy bytes 23 22 2 1 0 32 33 34 35 36 37 38 * 7 6 5 4 3 2 1 0 * device id power-down current stand-by current = msb * figure 28b. release power-down / device id instruction sequence diagram
w25q16cv - 52 - 7.2.31 read manufacturer / device id (90h) the read manufacturer/device id instruction is an alternative to the release from power-down / device id instruction that provides both the jedec assigned manufacturer id and the specific device id. the read manufacturer/device id instruction is very similar to the release from power-down / device id instruction. the instruction is initiated by driving the /cs pin low and shifting the instruction code ?90h? followed by a 24-bit address (a23-a0) of 000000h. after which, the manufacturer id for winbond (efh) and the device id are shifted out on the falling edge of clk with most significant bit (msb) first as shown in figure 29. the device id values for the w25q16c v is listed in manufacturer and device identification table. if the 24-bit address is initially set to 000001h the device id will be read first and then followed by the manufacturer id. the manufacturer and device ids can be read continuously, alternating from one to the other. the instruction is completed by driving /cs high. /cs clk di (io 0 ) do (io 1 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (90h) high impedance 8 9 10 28 29 30 31 address (000000h) 23 22 21 3 2 1 0 device id (io 1 ) * /cs clk di (io 0 ) do 32 33 34 35 36 37 38 39 40 41 42 44 45 46 7 6 5 4 3 2 1 0 * manufacturer id (efh) 43 31 0 mode 0 mode 3 = msb * figure 29. read manufacturer / device id diagram
w25q16cv publication release date: april 01, 2011 - 53 - revision c 7.2.32 read manufacturer / device id dual i/o (92h) the manufacturer / device id dual i/o instruction is an alternative to the read manufacturer/device id instruction that provides both the jedec assigned manufacturer id and the specific device id at 2x speed. the read manufacturer / device id dual i/o instruction is similar to the fast read dual i/o instruction. the instruction is initiated by driving the /cs pin low and shifting the instruction code ?92h? followed by a 24-bit address (a23-a0) of 000000h, 8-bit continuous read mode bits, with the capability to input the address bits two bits per clock. after which, the manufacturer id for winbond (efh) and the device id are shifted out 2 bits per clock on the falling edge of clk with most significant bits (msb) first as shown in figure 30. the device id values for the w25q16cv is listed in manufacturer and device identification table. if the 24-bit address is initially set to 000001h the device id will be read first and then followed by the manufacturer id. the manufacturer and device ids can be read continuously, alternating from one to the other. the instruction is completed by driving /cs high. /cs clk di (io 0 ) do (io 1 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (92h) high impedance 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 7 5 3 1 ** 6 4 2 0 7 5 3 1 6 4 2 0 7 5 3 1 6 4 2 0 7 5 3 1 6 4 2 0 23 ** a23-16 a15-8 a7-0 (00h) m7-0 /cs clk di (io 0 ) do 24 (io 1 ) 25 26 27 28 29 30 31 32 33 34 36 37 38 35 23 0 mode 0 mode 3 7 5 3 1 6 4 2 0 7 5 3 1 6 4 2 0 7 5 3 1 6 4 2 0 7 5 3 6 4 2 1 0 1 mfr id device id mfr id (repeat) device id (repeat) ios switch from input to output ** ** = msb * figure 30. read manufacturer / device id dual i/o diagram note: the ?continuous read mode? bits m7-0 must be set to fxh to be compatible with fast read dual i/o instruction.
w25q16cv - 54 - 7.2.33 read manufacturer / device id quad i/o (94h) the read manufacturer / device id quad i/o instruction is an alternative to the read manufacturer / device id instruction that provides both the jedec assigned manufacturer id and the specific device id at 4x speed. the read manufacturer / device id quad i/o instruction is similar to the fast read quad i/o instruction. the instruction is initiated by driving the /cs pin low and shifting the instruction code ?94h? followed by a 24-bit address (a23-a0) of 000000h, 8-bit continuous read mode bits and then four clock dummy cycles, with the capability to input the address bits four bits per clock. after which, the manufacturer id for winbond (efh) and the device id are shifted out four bits per clock on the falling edge of clk with most significant bit (msb) first as shown in figure 31. the device id values for the w25q16cv is listed in manufacturer and device identification table. if the 24-bit address is initially set to 000001h the device id will be read first and then followed by the manufacturer id. the manufacturer and device ids can be read continuously, alternating from one to the other. t he instruction is completed by driving /cs high. mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (94h) high impedance 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 5 1 4 0 23 mode 0 mode 3 ios switch from input to output high impedance 7 3 6 2 /cs clk io 0 io 1 io 2 io 3 high impedance a23-16 a15-8 a7-0 (00h) m7-0 mfr id device id dummy dummy /cs clk io 0 io 1 io 2 io 3 23 0 1 2 3 5 1 4 0 7 3 6 2 5 1 4 0 7 3 6 2 5 1 4 0 7 3 6 2 5 1 4 0 7 3 6 2 5 1 4 0 7 3 6 2 5 1 4 0 7 3 6 2 5 1 4 0 7 3 6 2 5 1 4 0 7 3 6 2 5 1 4 0 7 3 6 2 24 25 26 27 28 29 30 mfr id (repeat) device id (repeat) mfr id (repeat) device id (repeat) figure 31. read manufacturer / device id quad i/o diagram note: the ?continuous read mode? bits m7-0 must be set to fxh to be compatible with fast read quad i/o instruction.
w25q16cv publication release date: april 01, 2011 - 55 - revision c 7.2.34 read unique id number (4bh) the read unique id number instruction accesses a factory-set read-only 64-bit number that is unique to each w25q16cv device. the id number can be used in conjunction with user software methods to help prevent copying or cloning of a system. the read unique id instruction is initiated by driving the /cs pin low and shifting the instruction code ?4bh? followed by a four bytes of dummy clocks. after which, the 64- bit id is shifted out on the falling edge of clk as shown in figure 32. /cs clk di (io 0 ) do (io 1 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (4bh) high impedance 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 /cs clk di (io ) 24 0 do (io 1 ) 25 26 27 28 29 30 31 32 33 34 36 37 38 35 23 mode 0 mode 3 dummy byte 1 dummy byte 2 39 40 41 42 dummy byte 3 dummy byte 4 * 63 62 61 2 100 101 102 1 0 high impedance 64-bit unique serial number = msb * figure 32. read unique id number instruction sequence
w25q16cv - 56 - 7.2.35 read jedec id (9fh) for compatibility reasons, the w25q16cv provides several instructions to electronically determine the identity of the device. the read jedec id instruction is compatible with the jedec standard for spi compatible serial memories that was adopted in 2003. the instruction is initiated by driving the /cs pin low and shifting the instruction code ?9fh?. the jedec assigned manufacturer id byte for winbond (efh) and two device id bytes, memory type (id15-id8) and capacity (id7-id0) are then shifted out on the falling edge of clk with most significant bit (msb) first as shown in figure 33. for memory type and capacity values refer to manufacturer and device identification table. /cs clk di (io 0 ) do (io 1 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (9fh) high impedance 8 9 10 12 13 14 15 capacity id7-0 /cs clk di (io 0 ) do 16 (io 1 ) 17 18 19 20 21 22 23 manufacturer id (efh) 24 25 26 28 29 30 7 6 5 4 3 2 1 0 27 15 * mode 0 mode 3 11 7 6 5 4 3 2 1 0 * memory type id15-8 = msb * figure 33. read jedec id instruction sequence
w25q16cv publication release date: april 01, 2011 - 57 - revision c 7.2.36 read sfdp register (5ah) the w25q16cv features a 256-byte serial flash discoverable parameter (sfdp) register that contains information about device configurations, available in structions and other features. the sfdp parameters are stored in one or more parameter identification (pid) tables. currently only one pid table is specified, but more may be added in the future. the read sfdp register instruction is compatible with the sfdp standard initially established in 2010 for pc and other applications, as well as the jedec standard 1.0 that is published in 2011. most winbond spiflash memories shipped after june 2011 (date code 1124 and beyond) support the sfdp feature as specified in the applicable datasheet. the read sfdp instruction is initiated by driving the /cs pin low and shifting the instruction code ?5ah? followed by a 24-bit address (a23-a0) (1) into the di pin. eight ?dummy? clocks are also required before the sfdp register contents are shifted out on the falling edge of the 40 th clk with most significant bit (msb) first as shown in figure 34. for sfdp register values and descriptions, refer to the following sfdp definition table. note: 1. a23-a8 = 0; a7-a0 are used to define the starting byte address for the 256-byte sfdp register. /cs clk di (io 0 ) do (io 1 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (5ah) high impedance 8 9 10 28 29 30 31 24-bit address 23 22 21 3 2 1 0 data out 1 * /cs clk di (io 0 ) 32 do (io 1 ) 33 34 35 36 37 38 39 dummy byte high impedance 40 41 42 44 45 46 47 48 49 50 51 52 53 54 55 7 6 5 4 3 2 1 0 7 data out 2 7 6 5 4 3 2 1 0 43 31 0 * 7 6 5 4 3 2 1 0 * = msb * figure 34. read sfdp register instruction sequence diagram
w25q16cv - 58 - serial flash discoverable parameter (jedec revision 1.0) definition table byte address data description comment 00h 53h sfdp signature sfdp signature = 50444653h 01h 46h sfdp signature 02h 44h sfdp signature 03h 50h sfdp signature 04h 00h sfdp minor revision number jedec revision 1.0 05h 01h sfdp major revision number 06h 00h number of parameter headers (nph) 1 parameter header 07h ffh reserved 08h 00h pid (3) (0): id number 00h = jedec specified 09h 00h pid(0): parameter table minor revision number jedec revision 1.0 0ah 01h pid(0): parameter table major revision number 0bh 09h pid(0): parameter table length 9 dwords (2) 0ch 80h pid(0): parameter table pointer (ptp) (a7-a0) pid(0) pointer = 000080h 0dh 00h pid(0): parameter table pointer (ptp) (a15-a8) 0eh 00h pid(0): parameter table pointer (ptp) (a23-a16) 0fh ffh reserved 10h ffh reserved ... (1) ffh reserved 7fh ffh reserved 80h e5h bit[7:5]=111 reserved bit[4:3]=00 non-volatile status register bit[2] =1 page programmable bit[1:0]=01 supports 4kb erase 81h 20h 4k-byte erase opcode 82h f1h bit[7] =1 reserved bit[6] =1 supports (1-1-4) fast read bit[5] =1 supports (1-4-4) fast read bit[4] =1 supports (1-2-2) fast read bit[3] =0 not support dual transfer rate bit[2:1]=00 3-byte/24-bit only addressing bit[0] =1 supports (1-1-2) fast read 83h ffh reserved 84h ffh flash size in bits 16 mega bits = 00ffffffh 85h ffh flash size in bits 86h ffh flash size in bits 87h 00h flash size in bits
w25q16cv publication release date: april 01, 2011 - 59 - revision c 88h 44h bit[7:5]=010 8 mode bits are needed bit[4:0]=00100 16 dummy bits are needed fast read quad i/o setting 89h ebh quad input quad output fast read opcode 8ah 08h bit[7:5]=000 no mode bits are needed bit[4:0]=01000 8 dummy bits are needed fast read quad output setting 8bh 6bh single input quad output fast read opcode 8ch 08h bit[7:5]=000 no mode bits are needed bit[4:0]=01000 8 dummy bits are needed fast read dual output setting 8dh 3bh single input dual output fast read opcode 8eh 80h bit[7:5]=100 8 mode bits are needed bit[4:0]=00000 no dummy bits are needed fast read dual i/o setting 8fh bbh dual input dual output fast read opcode 90h eeh bit[7:5]=111 reserved bit[4] =0 not support (4-4-4) fast read bit[3:1]=111 reserved bit[0] =0 not support (2-2-2) fast read 91h ffh reserved 92h ffh reserved 93h ffh reserved 94h ffh reserved 95h ffh reserved 96h 00h no mode bits or dummy bits for (2-2-2) fast read 97h 00h not support (2-2-2) fast read 98h ffh reserved 99h ffh reserved 9ah 00h no mode bits or dummy bits for (4-4-4) fast read 9bh 00h not support (4-4-4) fast read 9ch 0ch sector type 1 size (4kb) sector erase type & opcode 9dh 20h sector type 1 opcode 9eh 0fh sector type 2 size (32kb) 9fh 52h sector type 2 opcode a0h 10h sector type 3 size (64kb) sector erase type & opcode a1h d8h sector type 3 opcode a2h 00h sector type 4 size (256kb) ? not supported a3h 00h sector type 4 opcode ? not supported ... (1) ffh reserved ffh ffh reserved notes: 1. data stored in byte address 10h to 7fh & a4h to ffh are reserved, the value is ffh. 2. 1 dword = 4 bytes 3. pid(x) = parameter identification table (x)
w25q16cv - 60 - 7.2.37 erase security registers (44h) the w25q16cv offers three 256-byte security registers which can be erased and programmed individually. these registers may be used by the system manufacturers to store security and other important information separately from the main memory array. the erase security register instruction is similar to the sector erase instruction. a write enable instruction must be executed before the device will accept the erase security register instruction (status register bit wel must equal 1). the instruction is initiated by driving the /cs pin low and shifting the instruction code ?44h? followed by a 24-bit address (a23-a0) to erase one of the three security registers. address a23-16 a15-12 a11-8 a7-0 security register #1 00h 0 0 0 1 0 0 0 0 don?t care security register #2 00h 0 0 1 0 0 0 0 0 don?t care security register #3 00h 0 0 1 1 0 0 0 0 don?t care the erase security register instruction sequence is shown in figure 35. the /cs pin must be driven high after the eighth bit of the last byte has been latched. if this is not done the instruction will not be executed. after /cs is driven high, the self-timed erase security register operation will commence for a time duration of t se (see ac characteristics). while the erase security register cycle is in progress, the read status register instruction may still be accessed for checking the status of the busy bit. the busy bit is a 1 during the erase cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions again. after the erase security register cycle has finished the write enable latch (wel) bit in the status register is cleared to 0. the security register lock bits lb[3:1] in the status register-2 can be used to otp protect the security registers. once a lock bit is set to 1, the corresponding security register will be permanently locked, erase security register instruction to that register will be ignored (see 7.1.9 for detail descriptions). /cs clk di (io 0 ) do (io 1 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (44h) high impedance 8 9 29 30 31 24-bit address 23 22 2 1 0 * mode 0 mode 3 = msb * figure 35. erase security registers instruction sequence
w25q16cv publication release date: april 01, 2011 - 61 - revision c 7.2.38 program security registers (42h) the program security register instruction is similar to the page program instruction. it allows from one byte to 256 bytes of security register data to be programmed at previously erased (ffh) memory locations. a write enable instruction must be executed before the device will accept the program security register instruction (status register bit wel= 1). t he instruction is initiated by driving the /cs pin low then shifting the instruction code ?42h? followed by a 24-bit address (a23-a0) and at least one data byte, into the di pin. the /cs pin must be held low for the entire length of the instruction while data is being sent to the device. address a23-16 a15-12 a11-8 a7-0 security register #1 00h 0 0 0 1 0 0 0 0 byte address security register #2 00h 0 0 1 0 0 0 0 0 byte address security register #3 00h 0 0 1 1 0 0 0 0 byte address the program security register instruction sequence is shown in figure 36. the security register lock bits lb[3:1] in the status register-2 can be used to otp protect the security registers. once a lock bit is set to 1, the corresponding security register will be permanently locked, program security register instruction to that register will be ignored (see 7.1.9, 7.2.21 for detail descriptions). /cs clk di (io 0 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (42h) 8 9 10 28 29 30 39 24-bit address 23 22 21 3 2 1 * /cs clk di (io ) 40 0 41 42 43 44 45 46 47 data byte 2 48 49 50 52 53 54 55 2072 7 6 5 4 3 2 1 0 51 39 0 31 0 32 33 34 35 36 37 38 data byte 1 7 6 5 4 3 2 1 * mode 0 mode 3 data byte 3 2073 2074 2075 2076 2077 2078 2079 0 data byte 256 * 7 6 5 4 3 2 1 0 * 7 6 5 4 3 2 1 0 * = msb * figure 36. program security registers instruction sequence
w25q16cv - 62 - 7.2.39 read security registers (48h) the read security register instruction is similar to the fast read instruction and allows one or more data bytes to be sequentially read from one of the three security registers. the instruction is initiated by driving the /cs pin low and then shifting the instruction code ?48h? followed by a 24-bit address (a23-a0) and eight ?dummy? clocks into the di pin. the code and address bits are latched on the rising edge of the clk pin. after the address is received, the data byte of the addressed memory location will be shifted out on the do pin at the falling edge of clk with most significant bit (msb) first. the byte address is automatically incremented to the next byte address after each byte of data is shifted out. once the byte address reaches the last byte of the register (byte ffh), it will reset to 00h, the first byte of the register, and continue to increment. the instruction is completed by driving /cs high. the read security register instruction sequence is shown in figure 37. if a read security register instruction is issued while an erase, program or write cycle is in process (busy=1) the instruction is ignored and will not have any effects on the current cycle. the read security register instruction allows clock rates from d.c. to a maximum of f r (see ac electrical characteristics). address a23-16 a15-12 a11-8 a7-0 security register #1 00h 0 0 0 1 0 0 0 0 byte address security register #2 00h 0 0 1 0 0 0 0 0 byte address security register #3 00h 0 0 1 1 0 0 0 0 byte address /cs clk di (io 0 ) do (io 1 ) mode 0 mode 3 0 1 2 3 4 5 6 7 instruction (48h) high impedance 8 9 10 28 29 30 31 24-bit address 23 22 21 3 2 1 0 data out 1 * /cs clk di (io 0 ) do 32 (io 1 ) 33 34 35 36 37 38 39 dummy byte high impedance 40 41 42 44 45 46 47 48 49 50 51 52 53 54 55 7 6 5 4 3 2 1 0 7 data out 2 * 7 6 5 4 3 2 1 0 * 7 6 5 4 3 2 1 0 43 31 0 = msb * figure 37. read security registers instruction sequence
w25q16cv publication release date: april 01, 2011 - 63 - revision c 8. electrical characteristics 8.1 absolute maximum ratings (1) parameters symbol conditions range unit supply voltage vcc ?0.6 to +4.6 v voltage applied to any pin v io relative to ground ?0.6 to vcc+0.4 v transient voltage on any pin v iot <20ns transient relative to ground ?2.0v to vcc+2.0v v storage temperature t stg ?65 to +150 c lead temperature t lead see note (2) c electrostatic discharge voltage v esd human body model (3) ?2000 to +2000 v notes: 1. this device has been designed and tested for the specified operation ranges. proper operation outside of these levels is not guaranteed. exposure to absolute maximum ratings may affect device reliability. exposure beyond absolute maximum ratings may cause permanent damage. 2. compliant with jedec standard j-std-20c for small body sn-pb or pb-free (green) assembly and the european directive on restrictions on hazardous substances (rohs) 2002/95/eu. 3. jedec std jesd22-a114a (c1=100pf, r1=1500 ohms, r2=500 ohms). 8.2 operating ranges parameter symbol conditions spec unit min max supply voltage (1) vcc f r = 80mhz, f r = 50mhz f r = 104mhz, f r = 50mhz f r = 50mhz (for e3h command) 2.7 3.0 3.0 3.6 3.6 3.6 v ambient temperature, operating t a commercial industrial automotive 0 -40 -40 +70 +85 +105 c note: 1. vcc voltage during read can operate across the min and max range but should not exceed 10% of the programming (erase/write) voltage.
w25q16cv - 64 - 8.3 power-up timing and write inhibit threshold parameter symbol spec unit min max vcc (min) to /cs low t vsl (1) 10 s time delay before write instruction t puw (1) 1 10 ms write inhibit threshold voltage v wi (1) 1.0 2.0 v note: 1. these parameters are characterized only. vcc tvsl read instructions allowed device is fully accessible tpuw /cs must track vcc program, erase and write instructions are ignored reset state vcc (max) vcc (min) v wi time figure 38. power-up timing and voltage levels
w25q16cv publication release date: april 01, 2011 - 65 - revision c 8.4 dc electrical characteristics parameter symbol conditions spec unit min typ max input capacitance c in (1) v in = 0v (1) 6 pf output capacitance cout (1) v out = 0v (1) 8 pf input leakage i li 2 a i/o leakage i lo 2 a standby current i cc 1 /cs = vcc, vin = gnd or vcc 10 25 a power-down current i cc 2 /cs = vcc, vin = gnd or vcc 1 5 a current read data / dual /quad 1mhz (2) i cc 3 c = 0.1 vcc / 0.9 vcc do = open 4/5/6 6/7.5/9 ma current read data / dual /quad 33mhz (2) i cc 3 c = 0.1 vcc / 0.9 vcc do = open 6/7/8 9/10.5/12 ma current read data / dual /quad 50mhz (2) i cc 3 c = 0.1 vcc / 0.9 vcc do = open 7/8/9 10/12/13.5 ma current read data / dual output read/quad output read 80mhz (2) i cc 3 c = 0.1 vcc / 0.9 vcc do = open 10/11/12 15/16.5/18 ma current write status register i cc 4 /cs = vcc 10 15 ma current page program i cc 5 /cs = vcc 20 25 ma current sector/block erase i cc 6 /cs = vcc 20 25 ma current chip erase i cc 7 /cs = vcc 20 25 ma input low voltage v il vcc x 0.3 v input high voltage v ih vcc x 0.7 v output low voltage v ol i ol = 100 a 0.2 v output high voltage v oh i oh = ?100 a vcc ? 0.2 v notes: 1. tested on sample basis and specified through design and characterization data. ta = 25 c, vcc = 3v. 2. checker board pattern.
w25q16cv - 66 - 8.5 ac measurement conditions parameter symbol spec unit min max load capacitance c l 30 pf input rise and fall times t r , t f 5 ns input pulse voltages v in 0.2 vcc to 0.8 vcc v input timing reference voltages in 0.3 vcc to 0.7 vcc v output timing reference voltages o ut 0.5 vcc to 0.5 vcc v note: 1. output hi-z is defined as the point where data out is no longer driven. i timi input levels 0.8 vcc 0.2 vcc nput and output ng reference levels 0.5 vcc figure 39. ac measurement i/o waveform
w25q16cv publication release date: april 01, 2011 - 67 - revision c 8.6 ac electrical characteristics description symbol alt spec unit min typ max clock frequency for all instructions, except read data (03h) & octal word read (e3h) 2.7v-3.6v vcc & industrial temperature f r f c d.c. 80 mhz clock frequency for all instructions, except read data (03h) & octal word read (e3h) 3.0v-3.6v vcc & commercial temperature f r f c d.c. 104 mhz clock frequency for octal word read quad i/o(e3h) 3.0v-3.6v & industrial temperature f r f c d.c. 50 mhz clock freq. read data instruction (03h) f r d.c. 50 mhz clock high, low time except read data (03h) t clh , t cll (1) 6 ns clock high, low time for read data (03h) instruction t crlh , t crll (1) 8 ns clock rise time peak to peak t clch (2) 0.1 v/ns clock fall time peak to peak t chcl (2) 0.1 v/ns /cs active setup time relative to clk t slch t css 5 ns /cs not active hold time relative to clk t chsl 5 ns data in setup time t dvch t dsu 2 ns data in hold time t chdx t dh 5 ns /cs active hold time relative to clk t chsh 5 ns /cs not active setup time relative to clk t shch 5 ns /cs deselect time (for array read ? array read) t shsl 1 t csh 10 ns /cs deselect time (for erase/program ? read sr) volatile status register write time t shsl 2 t csh 50 50 ns output disable time t shqz (2) t dis 7 ns clock low to output valid 2.7v-3.6v / 3.0v-3.6v t clqv 1 t v 1 7 / 6 ns clock low to output valid (for read id instructions) 2.7v-3.6v / 3.0v-3.6v t clqv 2 t v 2 8.5 / 7.5 ns output hold time t clqx t ho 0 ns /hold active setup time relative to clk t hlch 5 ns continued ? next page
w25q16cv - 68 - 8.7 ac electrical characteristics ( cont?d) description symbol alt spec unit min typ max /hold active hold time relative to clk t chhh 5 ns /hold not active setup time relative to clk t hhch 5 ns /hold not active hold time relative to clk t chhl 5 ns /hold to output low-z t hhqx (2) t lz 7 ns /hold to output high-z t hlqz (2) t hz 12 ns write protect setup time before /cs low t whsl (3) 20 ns write protect hold time after /cs high t shwl (3) 100 ns /cs high to power-down mode t dp (2) 3 s /cs high to standby mode without electronic signature read t res 1 (2) 3 s /cs high to standby mode wi th electronic signature read t res 2 (2) 1.8 s /cs high to next instruction after suspend t sus (2) 20 s write status register time t w 10 15 ms byte program time (first byte) (4) t bp1 30 50 s additional byte program ti me (after first byte) (4) t bp2 2.5 12 s page program time t pp 0.7 3 ms sector erase time (4kb) t se 30 200/400 (5) ms block erase time (32kb) t be 1 120 800 ms block erase time (64kb) t be 2 150 1000 ms chip erase time t ce 3 10 s notes: 1. clock high + clock low must be less than or equal to 1/f c . 2. value guaranteed by design and/or characterization, not 100% tested in production. 3. only applicable as a constraint for a write status register instruction when srp[1:0]=(0,1). 4. for multiple bytes after first byte within a page, t bpn = t bp1 + t bp2 * n (typical) and t bpn = t bp1 + t bp2 * n (max), where n = number of bytes programmed. 5. max value tse with <50k cycles is 200ms and >50k & <100k cycles is 400ms.
w25q16cv publication release date: april 01, 2011 - 69 - revision c /cs clk io output 8.8 serial output timing tclqx tclqv tclqx tclqv tshqz tcll lsb out tclh msb out 8.9 serial input timing /cs clk io input tchsl msb in tslch tdvch tchdx tshch tchsh tclch tchcl lsb in tshsl 8.10 /hold timing /cs clk io output /hold tchhl thlch tchhh thhch thlqz thhqx io input 8.11 /wp timing /cs clk /wp twhsl tshwl io input write status register is allowed write status register is not allowed
w25q16cv - 70 - 9. package specification 9.1 8-pin soic 150-mil (package code sn) l c d a1 a e b seating plane y 0.25 gauge plane e h e 4 1 5 8 l c d a1 a e b b b seating plane y 0.25 gauge plane e h e e h e 4 1 5 8 symbol millimeters inches min max min max a 1.35 1.75 0.053 0.069 a1 0.10 0.25 0.004 0.010 b 0.33 0.51 0.013 0.020 c 0.19 0.25 0.008 0.010 e (3 ) 3.80 4.00 0.150 0.157 d (3 ) 4.80 5.00 0.188 0.196 e (2 ) 1.27 bsc 0.050 bsc h e 5.80 6.20 0.228 0.244 y (4 ) --- 0.10 --- 0.004 l 0.40 1.27 0.016 0.050 0 10 0 10 notes: 1. controlling dimensions: millimeters, unless otherwise specified. 2. bsc = basic lead spacing between centers. 3. dimensions d and e do not include mold flash protrusions and should be measured from the bottom of the package. 4. formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
w25q16cv publication release date: april 01, 2011 - 71 - revision c 9.2 8-pin soic 208-mil (package code ss) gauge pl ane gauge pl ane symbol millimeters inches min nom max min nom max a 1.75 1.95 2.16 0.069 0.077 0.085 a1 0.05 0.15 0.25 0.002 0.006 0.010 a2 1.70 1.80 1.91 0.067 0.071 0.075 b 0.35 0.42 0.48 0.014 0.017 0.019 c 0.19 0.20 0.25 0.007 0.008 0.010 d 5.18 5.28 5.38 0.204 0.208 0.212 d1 5.13 5.23 5.33 0.202 0.206 0.210 e 5.18 5.28 5.38 0.204 0.208 0.212 e1 5.13 5.23 5.33 0.202 0.206 0.210 e (2 ) 1.27 bsc. 0.050 bsc. h 7.70 7.90 8.10 0.303 0.311 0.319 l 0.50 0.65 0.80 0.020 0.026 0.031 y --- --- 0.10 --- --- 0.004 0 --- 8 0 --- 8 notes: 1. controlling dimensions: millimeters, unless otherwise specified. 2. bsc = basic lead spacing between centers. 3. dimensions d1 and e1 do not include mold flash protrusions and should be measured from the bottom of the package. 4. formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
w25q16cv - 72 - 9.3 8-pin pdip 300-mil (package code da) symbol millimeters inches min nom max min nom max a --- --- 5.33 --- --- 0.210 a1 0.38 --- --- 0.015 --- --- a2 3.18 3.30 3.43 0.125 0.130 0.135 d 9.02 9.27 10.16 0.355 0.365 0.400 e 7.62 bsc. 0.300 bsc. e1 6.22 6.35 6.48 0.245 0.250 0.255 l 2.92 3.30 3.81 0.115 0.130 0.150 e b 8.51 9.02 9.53 0.335 0.355 0.375 0 7 15 0 7 15
w25q16cv publication release date: april 01, 2011 - 73 - revision c 9.4 8-pad wson 6x5mm (package code zp) symbol millimeters inches min nom max min nom max a 0.70 0.75 0.80 0.028 0.030 0.031 a1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.35 0.40 0.48 0.014 0.016 0.019 c --- 0.20 ref. --- --- 0.008 ref. --- d 5.90 6.00 6.10 0.232 0.236 0.240 d2 3.35 3.40 3.45 0.132 0.134 0.136 e 4.90 5.00 5.10 0.193 0.197 0.201 e2 4.25 4.30 4.35 0.167 0.169 0.171 e (2 ) 1.27 bsc. 0.050 bsc. l 0.55 0.60 0.65 0.022 0.024 0.026 y 0.00 --- 0.075 0.000 --- 0.003
w25q16cv - 74 - 8-pad wson 6x5mm cont?d. symbol millimeters inches min nom max min nom max solder pattern m 3.40 0.134 n 4.30 0.169 p 6.00 0.236 q 0.50 0.020 r 0.75 0.026 notes: 1. advanced packaging information; please contact winbond for the latest minimum and maximum specifications. 2. bsc = basic lead spacing between centers. 3. dimensions d and e do not include mold flash protrusions and should be measured from the bottom of the package. 4. the metal pad area on the bottom center of the package is connected to the device ground (gnd pin). avoid placement of exposed pcb vias under the pad.
w25q16cv publication release date: april 01, 2011 - 75 - revision c 9.5 16-pin soic 300-mil (package code sf) gauge plane detail a gauge plane detail a symbol millimeters inches min nom max min nom max a 2.36 2.49 2.64 0.093 0.098 0.104 a1 0.10 --- 0.30 0.004 --- 0.012 a2 --- 2.31 --- --- 0.091 --- b 0.33 0.41 0.51 0.013 0.016 0.020 c 0.18 0.23 0.28 0.007 0.009 0.011 d 10.08 10.31 10.49 0.397 0.406 0.413 e 10.01 10.31 10.64 0.394 0.406 0.419 e1 7.39 7.49 7.59 0.291 0.295 0.299 e (2) 1.27 bsc. 0.050 bsc. l 0.38 0.81 1.27 0.015 0.032 0.050 y --- --- 0.076 --- --- 0.003 0 --- 8 0 --- 8 notes: 1. controlling dimensions: inches, unless otherwise specified. 2. bsc = basic lead spacing between centers. 3. dimensions d and e1 do not include mold flash protrusions and should be measured from the bottom of the package.
w25q16cv - 76 - 9.6 24-ball tfbga 8x6-mm (package code tc) symbol millimeters inches min nom max min nom max a --- --- 1.20 --- --- 0.047 a1 0.25 0.30 0.35 0.010 0.012 0.014 b 0.35 0.40 0.45 0.014 0.016 0.018 d 7.95 8.00 8.05 0.313 0.315 0.317 d1 5.00 bsc 0.197 bsc e 5.95 6.00 6.05 0.234 0.236 0.238 e1 3.00 bsc 0.118 bsc e 1.00 bsc 0.039 bsc
w25q16cv publication release date: april 01, 2011 - 77 - revision c 10. ordering information w (1) 25q 16c v x x (2) i = industrial (-40c to +85c) a = automotive (-40c to +105c) sn = 8-pin soic 150-mil zp = 8-pad wson 6x5-mm sf = 16-pin soic 300-mil ss = 8-pin soic 208-mil da = 8-pin pdip 300-mil tc = 24-ball tfbga 8x6-mm (3,4) g = green package (lead-free, rohs compliant, halogen-free (tbba), an timony-oxide-free sb 2 o 3 ) p = green package with status register power-down & otp enabled v = 2.7v to 3.6v 16c = 16m-bit 25q = spiflash serial flash memory with 4kb sectors, dual/quad i/o w = winbond notes: 1. the ?w? prefix is not included on the part marking. 2. only the 2 nd letter is used for the part marking; wson pa ckage type zp is not used for the part marking. 3. standard bulk shipments are in tube (shape e). please specify alternate packing method, such as tape and reel (shape t) or tray (shape s), when placing orders. 4. for shipments with otp feature enabled, please specify when placing orders.
w25q16cv - 78 - 10.1 valid part numbers and top side marking the following table provides the valid part numbers for the w25q16cv spiflash memory. please contact winbond for specific availability by density and package type. winbond spiflash memories use an 12-digit product number for ordering. however, due to limited space, the top side marking on all packages use an abbreviated 10-digit number. part numbers for industrial temperature: package type density product number top side marking sn (2) soic-8 150mil 16m-bit w25q16cvsnig w25q16cvsnip 25q16cvnig 25q16cvnip ss soic-8 208mil 16m-bit w25q16cvssig w25q16cvssip 25q16cvsig 25q16cvsip sf (2) soic-16 300mil 16m-bit w25q16cvsfig w25q16cvsfip 25q16cvfig 25q16cvfip zp (1) wson-8 6x5mm 16m-bit w25q16cvzpig w25q16cvzpip 25q16cvig 25q16cvip da (2) pdip-8 300mil 16m-bit w25q16cvdaig w25q16cvdaip 25q16cvaig 25q16cvaip tc tfbga-24 8x6mm 16m-bit w25q16cvtcig w25q16cvtcip 25q16cvcig 25q16cvcip part numbers for automotive temperature (3) : package type density product number top side marking sn (2) soic-8 150mil 16m-bit w25q16cvsnag w25q16cvsnap 25q16cvnag 25q16cvnap ss soic-8 208mil 16m-bit w25q16cvssag w25q16cvssap 25q16cvsag 25q16cvsap sf (2) soic-16 300mil 16m-bit w25q16cvsfag W25Q16CVSFAP 25q16cvfag 25q16cvfap zp (1) wson-8 6x5mm 16m-bit w25q16cvzpag w25q16cvzpap 25q16cvag 25q16cvap da (2) pdip-8 300mil 16m-bit w25q16cvdaag w25q16cvdaap 25q16cvaag 25q16cvaap tc tfbga-24 8x6mm 16m-bit w25q16cvtcag w25q16cvtcap 25q16cvcag 25q16cvcap notes: 1. wson package type zp is not used in the top side marking. 2. these package types are special order only, please contact winbond for more information. 3. for automotive temperature parts, please contact winbond for availability.
w25q16cv publication release date: april 01, 2011 - 79 - revision c 11. revision history version date page description a 01/04/10 new create preliminary b 07/15/10 17 61, 64 5, 62 & 66 5, 10, 21, 56-58 5, 75 & 76 updated memory protection table updated parameter vil/vih, icc, tse updated fr & f r frequenices added sfdp feature added automotive temperature c 04/01/11 9, 76-78, 23-69, 47 57-59 added tfbga package updated diagrams added /wp timing diagram updated suspend description updated sfdp to jedec 1.0 removed preliminary designator trademarks winbond and spiflash are trademarks of winbond electronics corporation. all other marks are the property of their respective owner. important notice winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. further more, winbond products are not intended for applications wherein failure of winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify winbond for any damages resulting from such improper use or sales.

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